WAFER INTEGRATED OPTICAL SUB-MODULES
    1.
    发明申请
    WAFER INTEGRATED OPTICAL SUB-MODULES 有权
    WAFER集成光模块

    公开(公告)号:US20110274395A1

    公开(公告)日:2011-11-10

    申请号:US12774977

    申请日:2010-05-06

    IPC分类号: G02B6/42 G02B6/36 G02B5/28

    摘要: Described herein are a method to manufacture an optical sub-module which integrates both optical (e.g., micro-lens, optical filter, micro-mirrors) and/or electrical passive devices (e.g., capacitors, inductors, resistors) and systems on a wafer level. Such integration eliminates several assembly steps and therefore improves the optical misalignment tolerance for the optical link.

    摘要翻译: 本文描述了一种制造光学子模块的方法,该子模块将光学(例如,微透镜,滤光器,微镜)和/或无源器件(例如,电容器,电感器,电阻器)和系统集成在晶片上 水平。 这种集成消除了几个组装步骤,因此改善了光链路的光学偏移公差。