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公开(公告)号:US12100912B2
公开(公告)日:2024-09-24
申请号:US18380672
申请日:2023-10-17
申请人: Molex, LLC
发明人: Kirk B. Peloza , Vivek Shah , Andrew Kolak , Dan Wenzel , Matt Cox , Ayman Isaac
IPC分类号: H01R13/6581 , H01R13/627 , H01R13/6471 , H01R13/6598
CPC分类号: H01R13/6581 , H01R13/6275 , H01R13/6471 , H01R13/6598
摘要: A number of connectors and related methods that allow for high data rate transmissions are described. An example connector includes a housing and a wafer. The water includes signal conductors, a ground conductors, a flexible shield, and a rigid shield. The flexible shield includes terminal end portions, cantilever spring end portions, and a flexible shield body between the terminal end portions and the cantilever spring end portions. The flexible shield body covers a first portion of the ground conductors, and the rigid shield covers a second portion of the ground conductors.
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公开(公告)号:US20240047923A1
公开(公告)日:2024-02-08
申请号:US18380672
申请日:2023-10-17
申请人: Molex, LLC
发明人: Kirk B. Peloza , Vivek Shah , Andrew Kolak , Dan Wenzel , Matt Cox , Ayman Isaac
IPC分类号: H01R13/6581 , H01R13/627 , H01R13/6471 , H01R13/6598
CPC分类号: H01R13/6581 , H01R13/6275 , H01R13/6471 , H01R13/6598
摘要: A number of connectors and related methods that allow for high data rate transmissions are described. An example connector includes a housing and a wafer. The water includes signal conductors, a ground conductors, a flexible shield, and a rigid shield. The flexible shield includes terminal end portions, cantilever spring end portions, and a flexible shield body between the terminal end portions and the cantilever spring end portions. The flexible shield body covers a first portion of the ground conductors, and the rigid shield covers a second portion of the ground conductors.
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公开(公告)号:US20230275372A1
公开(公告)日:2023-08-31
申请号:US18144268
申请日:2023-05-08
申请人: Molex, LLC
发明人: Andrew Kolak , Dominic Steier , Li Zhuang , Scott Sommers
IPC分类号: H01R13/6471 , H01R13/6583 , H01R13/629 , H01R43/24 , H01R13/502 , H01R12/70 , H01R12/71 , H01R13/6587
CPC分类号: H01R13/6471 , H01R13/6583 , H01R13/629 , H01R43/24 , H01R13/502 , H01R12/707 , H01R12/71 , H01R13/6587 , H01R13/514
摘要: High-speed connectors and connector assemblies that can utilize a variety of connector side plate designs and that can include structures for improved thermal performance.
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公开(公告)号:USD1047916S1
公开(公告)日:2024-10-22
申请号:US29839642
申请日:2022-05-23
申请人: Molex, LLC
设计人: Thomas R. Marrapode , Jesus Enrique Fung , Andrew Kolak , Wenzong Chen , Sung-Ping Huang , Chih Chung Wu , Sheng-Pin Su , Chien-Lang Tai
摘要: FIG. 1 is a rear-top-right perspective view of a connector housing showing our new design;
FIG. 2 is a left side view thereof;
FIG. 3 is a right side view thereof;
FIG. 4 is an enlarged view of FIG. 1 as identified by region 4 of FIG. 1;
FIG. 5 is a rear-top-left perspective cross-section view taken through line 5-5 of FIG. 1;
FIG. 6 is a front-top-left perspective a cross-section view taken through line 5-5 of FIG. 1;
FIG. 7 is a top cross-sectional view taken through line 5-5 of FIG. 1;
FIG. 8 is a bottom-right perspective cross-section view taken through line 8-8 of FIG. 1;
FIG. 9 is a second bottom-right perspective cross-section view taken through line 8-8 of FIG. 1; and,
FIG. 10 is a bottom view taken through line 8-8 of FIG. 1.
The uneven-length broken line immediately adjacent to the shaded area defines the bounds of the claimed design and forms no part thereof. The even-length broken lines depicting the remainder of the connector housing form no part of the claimed design. The even-length broken lines highlighting the region 4 represent the enlarged view and form no part of the claimed design. The uneven-length broken lines showing the cross-sectional lines represent the cross-sectional views and form no part of the claimed design.-
公开(公告)号:USD1040765S1
公开(公告)日:2024-09-03
申请号:US29837001
申请日:2022-04-29
申请人: Molex, LLC
设计人: Thomas R. Marrapode , Jesus Enrique Fung , Andrew Kolak , Wenzong Chen , Sung-Ping Huang , Chih Chung Wu , Sheng-Pin Su , Chien-Lang Tai
摘要: FIG. 1 is a front perspective view of a connector showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a right side view thereof;
FIG. 5 is a left side view thereof;
FIG. 6 is a top view thereof; and,
FIG. 7 is a bottom view thereof.
The broken lines depicting the remainder of the connector form no part of the claimed design.-
公开(公告)号:USD1036388S1
公开(公告)日:2024-07-23
申请号:US29837002
申请日:2022-04-29
申请人: Molex, LLC
设计人: Thomas R. Marrapode , Jesus Enrique Fung , Andrew Kolak , Wenzong Chen , Sung-Ping Huang , Chih Chung Wu , Sheng-Pin Su , Chien-Lang Tai
摘要: FIG. 1 is a front perspective view of connector showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a right side view thereof;
FIG. 5 is a left side view thereof;
FIG. 6 is a top view thereof; and,
FIG. 7 is a bottom view thereof.
The broken lines depicting the remainder of the connector form no part of the claimed design.-
公开(公告)号:US11848522B2
公开(公告)日:2023-12-19
申请号:US17288956
申请日:2019-12-03
申请人: Molex, LLC
发明人: Kirk B. Peloza , Vivek Shah , Andrew Kolak , Dan Wenzel , Matt Cox , Ayman Isaac
IPC分类号: H01R13/648 , H01R13/6581 , H01R13/627 , H01R13/6471 , H01R13/6598
CPC分类号: H01R13/6581 , H01R13/6275 , H01R13/6471 , H01R13/6598
摘要: Input/output (I/O) connectors (1) for conducting data at high data rates, (e.g. 112 gigabits per second or more) are provided with protective shields (4, 5, 6) to provide increased mechanical strength and signal integrity.
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公开(公告)号:US11682864B2
公开(公告)日:2023-06-20
申请号:US17229933
申请日:2021-04-14
申请人: Molex, LLC
发明人: Andrew Kolak , Dominic Steier , Li Zhuang , Scott Sommers
IPC分类号: H01R13/6471 , H01R13/6583 , H01R13/629 , H01R43/24 , H01R13/502 , H01R12/70 , H01R12/71 , H01R13/6587 , H01R13/514 , H01R13/6581 , H01R13/506
CPC分类号: H01R13/6471 , H01R12/707 , H01R12/71 , H01R13/502 , H01R13/629 , H01R13/6583 , H01R13/6587 , H01R43/24 , H01R13/506 , H01R13/514 , H01R13/6581
摘要: Various examples of high speed connectors and connector assemblies that use connector side plate designs and include structures for improved thermal performance are described. In one example, a connector assembly includes a housing, a side plate on one side of the housing, and a wafer assembly that includes a row of conductors and a protrusion, with the protrusion being located at one end of the row of conductors. The side plate can include an aperture, and the protrusion can be inserted into the aperture to align the row of conductors.
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