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公开(公告)号:US12100912B2
公开(公告)日:2024-09-24
申请号:US18380672
申请日:2023-10-17
Applicant: Molex, LLC
Inventor: Kirk B. Peloza , Vivek Shah , Andrew Kolak , Dan Wenzel , Matt Cox , Ayman Isaac
IPC: H01R13/6581 , H01R13/627 , H01R13/6471 , H01R13/6598
CPC classification number: H01R13/6581 , H01R13/6275 , H01R13/6471 , H01R13/6598
Abstract: A number of connectors and related methods that allow for high data rate transmissions are described. An example connector includes a housing and a wafer. The water includes signal conductors, a ground conductors, a flexible shield, and a rigid shield. The flexible shield includes terminal end portions, cantilever spring end portions, and a flexible shield body between the terminal end portions and the cantilever spring end portions. The flexible shield body covers a first portion of the ground conductors, and the rigid shield covers a second portion of the ground conductors.
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公开(公告)号:US20240405483A1
公开(公告)日:2024-12-05
申请号:US18801866
申请日:2024-08-13
Applicant: Molex, LLC
Inventor: Kirk B. Peloza , Vivek Shah , Andrew Kolak , Dan Wenzel , Matt Cox , Ayman Isaac
IPC: H01R13/6581 , H01R13/627 , H01R13/6471 , H01R13/6598
Abstract: A number of connectors and related methods that allow for high data rate transmissions are described. An example connector includes a housing and a wafer. The water includes signal conductors, a ground conductors, a flexible shield, and a rigid shield. The flexible shield includes terminal end portions, cantilever spring end portions, and a flexible shield body between the terminal end portions and the cantilever spring end portions. The flexible shield body covers a first portion of the ground conductors, and the rigid shield covers a second portion of the ground conductors.
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公开(公告)号:US11848522B2
公开(公告)日:2023-12-19
申请号:US17288956
申请日:2019-12-03
Applicant: Molex, LLC
Inventor: Kirk B. Peloza , Vivek Shah , Andrew Kolak , Dan Wenzel , Matt Cox , Ayman Isaac
IPC: H01R13/648 , H01R13/6581 , H01R13/627 , H01R13/6471 , H01R13/6598
CPC classification number: H01R13/6581 , H01R13/6275 , H01R13/6471 , H01R13/6598
Abstract: Input/output (I/O) connectors (1) for conducting data at high data rates, (e.g. 112 gigabits per second or more) are provided with protective shields (4, 5, 6) to provide increased mechanical strength and signal integrity.
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公开(公告)号:US20240047923A1
公开(公告)日:2024-02-08
申请号:US18380672
申请日:2023-10-17
Applicant: Molex, LLC
Inventor: Kirk B. Peloza , Vivek Shah , Andrew Kolak , Dan Wenzel , Matt Cox , Ayman Isaac
IPC: H01R13/6581 , H01R13/627 , H01R13/6471 , H01R13/6598
CPC classification number: H01R13/6581 , H01R13/6275 , H01R13/6471 , H01R13/6598
Abstract: A number of connectors and related methods that allow for high data rate transmissions are described. An example connector includes a housing and a wafer. The water includes signal conductors, a ground conductors, a flexible shield, and a rigid shield. The flexible shield includes terminal end portions, cantilever spring end portions, and a flexible shield body between the terminal end portions and the cantilever spring end portions. The flexible shield body covers a first portion of the ground conductors, and the rigid shield covers a second portion of the ground conductors.
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