公开(公告)号：US07140103B2

公开(公告)日：2006-11-28

申请号：US10170614

申请日：2002-06-14

申请人： Morio Gaku ,  Nobuyuk Ikeguchi ,  Katsuji Komatsu ,  Yasuo Tanaka ,  Keiichi Iwata ,  Ken-ichi Shimizu

发明人： Morio Gaku ,  Nobuyuk Ikeguchi ,  Katsuji Komatsu ,  Yasuo Tanaka ,  Keiichi Iwata ,  Ken-ichi Shimizu

IPC分类号： H01K3/10

CPC分类号： H05K3/025 ,  H05K3/108 ,  H05K3/427 ,  H05K2201/0347 ,  H05K2203/0723 ,  Y10T29/49155 ,  Y10T29/49165

摘要： Process for producing a high-density printed wiring board, comprising: providing an ultrathin-copper-foil-clad board having a hole and outermost copper foil thickness of 5 μm or less, plating the surface by electroless copper plating to form a layer of 0.1 to 1 μm thickness, forming an electrolytic copper plating layer of 0.5 to 3 μm thickness using the electroless copper plating layer as electrode, forming a plating resist layer on a portion of the copper plating layer, forming a pattern copper plating layer of 6 to 30 μm thickness on the copper surface in where the plating resist layer is not formed, by electrolytic plating, removing the plating resist layer, and etching the entire surface to remove the thin electrolytic copper layer, the electroless copper layer and ultrathin copper foil layer at least where the pattern copper plating layer is not formed.

摘要翻译： 一种制造高密度印刷电路板的方法，包括：提供一种具有孔和最外铜箔厚度为5μm或更小的超薄铜箔包覆板，通过无电镀铜将表面镀覆以形成0.1层 使用无电镀铜层作为电极，形成0.5〜3μm厚的电解镀铜层，在铜镀层的一部分上形成电镀抗蚀剂层，形成6〜30μm的图案镀铜层 通过电解电镀，去除电镀抗蚀剂层，并蚀刻整个表面以除去薄的电解铜层，化学镀铜层和超薄铜箔层至少在铜表面上形成的电镀抗蚀剂层的厚度 其中未形成图案铜镀层。