公开(公告)号：US20040207054A1

公开(公告)日：2004-10-21

申请号：US10420054

申请日：2003-04-21

申请人： Motorola, Inc.

发明人： Clem H. Brown ,  Wai Wong Chow ,  Frank J. Mosna JR.

IPC分类号： H01L023/48 ,  H01L021/48

CPC分类号： A61B5/14532 ,  A61B5/0002 ,  A61B5/14546 ,  A61B5/7445 ,  G06F19/00 ,  G06Q50/22 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3011 ,  Y02A90/22 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor component for electrical coupling to a substrate (230) includes: a semiconductor chip (110); a non-leaded leadframe (120) including a plurality of electrical contacts (130) located around a periphery (111) of the semiconductor chip; a first electrical conductor (140) electrically coupling together the semiconductor chip and the non-leaded leadframe; and a mold compound (210) disposed around the semiconductor chip, the first electrical conductor, and the plurality of electrical contacts. At least one electrical contact of the plurality of electrical contacts includes: a first surface (310) having a first surface area for electrically coupling to the semiconductor chip; and a second surface (320) opposite the first surface and having a second surface area for electrically coupling to the substrate, where the second surface area is larger than the first surface area.

摘要翻译： 用于与衬底（230）电耦合的半导体部件包括：半导体芯片（110）; 包括位于所述半导体芯片的外围（111）周围的多个电触点（130）的非引线引线框架（120） 电连接半导体芯片和非引线引线框的第一电导体（140）; 以及设置在半导体芯片周围的模具化合物（210），第一电导体和多个电触头。 多个电触头中的至少一个电触点包括：第一表面（310），其具有用于电耦合到半导体芯片的第一表面区域; 和与所述第一表面相对的第二表面（320），并且具有用于电耦合到所述基底的第二表面区域，其中所述第二表面积大于所述第一表面区域。