公开(公告)号：US20250096769A1

公开(公告)日：2025-03-20

申请号：US18966231

申请日：2024-12-03

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Andrew KAY ,  Sean MCHUGH ,  John KOULAKIS ,  Albert CARDONA

IPC: H03H9/02 ,  H03H3/02 ,  H03H9/13 ,  H03H9/17 ,  H03H9/56

Abstract: A filter device is provided that includes a plurality of bulk acoustic resonators that each includes a piezoelectric layer; a conductor pattern on the piezoelectric layer and including an interdigital transducer (IDT) having a first plurality of fingers extending from a first busbar and a second plurality of fingers extending from the second busbar, such that the first plurality of fingers and the second plurality of fingers are interleaved with each other; a dielectric strip that overlaps a margin of the first plurality of fingers and that extends into a gap between ends of the first plurality of fingers and the second busbar. Moreover, a thickness ts of the dielectric strip a first bulk acoustic resonator of the plurality of bulk acoustic resonators is different than a thickness ts of the dielectric strip of a second bulk acoustic resonator of the plurality of bulk acoustic resonators.

公开(公告)号：US20250015774A1

公开(公告)日：2025-01-09

申请号：US18893017

申请日：2024-09-23

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Albert CARDONA ,  Andrew KAY ,  Chris O'BRIEN

IPC: H03H3/02 ,  H03H9/02 ,  H03H9/205 ,  H03H9/56

Abstract: An acoustic resonator device is provided that includes a wafer having a wafer surface and a wafer conductor pattern on the wafer surface; a piezoelectric layer having front and back surfaces, a portion of the piezoelectric layer being over a cavity between the wafer and the piezoelectric layer, and the wafer conductor pattern; a device conductor pattern including a first metal layer including an interdigital transducer on the front surface of the piezoelectric layer and facing the wafer, and a second metal layer attached to a portion of the device conductor pattern to provide an electrical connection between the IDT and the wafer conductor pattern. The second metal layer is bonded to the wafer conductor pattern and the piezoelectric layer comprises openings extending therethrough.

公开(公告)号：US20250062747A1

公开(公告)日：2025-02-20

申请号：US18935753

申请日：2024-11-04

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Andrew KAY ,  Patrick TURNER ,  Albert CARDONA

IPC: H03H9/54 ,  H03H3/02 ,  H03H9/02 ,  H03H9/13 ,  H03H9/17 ,  H03H9/205 ,  H03H9/56

Abstract: A filter device is provided that includes a substrate having a surface; and a piezoelectric layer over a first cavity and a second cavity. The piezoelectric layer is attached to the surface of the substrate either directly or via one or more intermediate layers. An area of the piezoelectric layer has a first thickness for at least one first resonator that forms at least one first membrane over the first cavity. Moreover, an area of the piezoelectric layer has a second thickness for at least one second resonator that forms at least one second membrane over the second cavity, the second thickness being thinner than the first thickness. A bottom of the first cavity that is opposite from the at least one first membrane extends farther down away from the piezoelectric layer than a bottom of the second cavity that is opposite from the at least one second membrane.

公开(公告)号：US20250088172A1

公开(公告)日：2025-03-13

申请号：US18959780

申请日：2024-11-26

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Albert CARDONA ,  Chris O'BRIEN ,  Greg DYER

IPC: H03H9/13 ,  H03H9/02 ,  H03H9/15 ,  H03H9/17 ,  H03H9/54 ,  H03H9/56 ,  H10N30/05 ,  H10N30/06 ,  H10N30/20

Abstract: A bulk acoustic resonator is provided that includes a substrate having a surface; a piezoelectric layer attached to the surface of the substrate via a bonding oxide (BOX) layer over the surface of the substrate; a conductor pattern including an interdigital transducer (IDT) that has interleaved fingers on a surface of the piezoelectric layer; at least one contact pad disposed at a selected location over the surface of the substrate and that is electrically connected to the IDT; and an electrically isolating layer between the at least one contact pad and the surface of the substrate. Moreover, at least a portion of the piezoelectric layer is absent between the at least one contact pad and the surface of the substrate.