公开(公告)号：US20250047258A1

公开(公告)日：2025-02-06

申请号：US18924099

申请日：2024-10-23

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Sean MCHUGH ,  Bryant GARCIA ,  Ventsislav YANTCHEV ,  Greg DYER

IPC: H03H9/17 ,  H03H9/13 ,  H03H9/54

Abstract: An acoustic resonator device is provided that includes a substrate; a piezoelectric plate having front and back surfaces, the back surface attached to the substrate; a decoupling dielectric layer on the front surface of the piezoelectric plate; and an interdigital transducer (IDT) on the decoupling dielectric layer such that interleaved fingers of the IDT are over a portion of the piezoelectric plate that is over a cavity. Moreover, a thickness of the interleaved fingers is greater than or equal to 0.6 times a thickness of the piezoelectric plate and less than or equal to 1.7 times the thickness of the piezoelectric plate.

公开(公告)号：US20250088167A1

公开(公告)日：2025-03-13

申请号：US18960226

申请日：2024-11-26

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kuan ZHANG ,  James R. COSTA ,  Andrew KAY ,  Greg DYER ,  Viktor PLESSKI ,  Soumya YANDRAPALLI ,  Robert B. HAMMOND ,  Bryant GARCIA ,  Patrick TURNER ,  Jesson JOHN ,  Ventsislav YANTCHEV

IPC: H03H9/02 ,  H03H3/02 ,  H03H3/04 ,  H03H9/13 ,  H03H9/17 ,  H03H9/56

Abstract: Acoustic filters, resonators and methods are disclosed. An acoustic filter device includes a substrate; a piezoelectric layer attached to the substrate, wherein at least a portion of the piezoelectric layer is disposed over a cavity of the acoustic resonator device; and an interdigital transducer (IDT) on a surface of the piezoelectric layer, the IDT including interleaved fingers extending at least over the portion of the piezoelectric layer disposed over the cavity. The cavity has at least one rounded corner, and a portion of interleaved fingers extend from at least one busbar. Moreover, at least a portion of the rounded corner of the cavity is under the at least one busbar in a plan view of the piezoelectric layer.

公开(公告)号：US20230246631A1

公开(公告)日：2023-08-03

申请号：US18159904

申请日：2023-01-26

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Greg DYER ,  Filip IIiev

IPC: H03H9/17 ,  H03H9/56 ,  H03H9/02 ,  H03H9/13

CPC classification number: H03H9/173 ,  H03H9/564 ,  H03H9/02031 ,  H03H9/133

Abstract: A filter may include a substrate and a rotated YX-cut piezoelectric plate coupled to the substrate. The filter also may include an interdigital transducer (IDT) formed on a portion of the rotated YX-cut piezoelectric plate forming a diaphragm that spans a cavity between the rotated YX-cut piezoelectric plate and the substrate. The IDT includes interleaved fingers that are disposed on the diaphragm. The IDT has an aperture that is less than or equal to 4 times a pitch of the interleaved fingers.

公开(公告)号：US20250030399A1

公开(公告)日：2025-01-23

申请号：US18773084

申请日：2024-07-15

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Bryant GARCIA ,  Bryan KIMBRELL ,  John P. KOULAKIS ,  Greg DYER ,  Patrick TURNER

IPC: H03H9/08 ,  H03H3/02 ,  H03H9/02 ,  H03H9/10 ,  H03H9/17 ,  H03H9/56

Abstract: A device may include a substrate that includes a base and an intermediate layer. A device may include a piezoelectric layer supported by the substrate except for a portion of the piezoelectric layer forming a diaphragm that spans a helium filled cavity that extends at least partially in the intermediate layer. A device may include an interdigital transducer (IDT) at a surface of the piezoelectric layer and having interleaved fingers on the diaphragm that have a thickness that is less than 0.5 times a thickness of the diaphragm and greater than 0.2 times the thickness of the diaphragm, wherein one of the base and the intermediate layer of the substrate defines a bottom surface of the helium filled cavity that faces the diaphragm such that a cavity depth is between 1.0 μm to 6.0 μm.

公开(公告)号：US20240243727A1

公开(公告)日：2024-07-18

申请号：US18620535

申请日：2024-03-28

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Douglas JACHOWSKI ,  Greg DYER

IPC: H03H9/56 ,  H03H3/02 ,  H03H9/02 ,  H03H9/13 ,  H03H9/17

CPC classification number: H03H9/568 ,  H03H3/02 ,  H03H9/02031 ,  H03H9/02228 ,  H03H9/132 ,  H03H9/174 ,  H03H9/176 ,  H03H2003/023

Abstract: Radio frequency filters are disclosed. A bandpass filter is discloses that includes one first bulk acoustic resonator on a first chip including a first piezoelectric layer having an LN-equivalent thickness less than or equal to 535 nm; a second bulk acoustic resonator on a second chip including a second piezoelectric layer having a thickness greater than the LN-equivalent thickness of the piezoelectric layer on the first chip; and a circuit card coupled to the first chip and the second chip and that electrically connects the first chip to the second chip.

公开(公告)号：US20240235525A9

公开(公告)日：2024-07-11

申请号：US18488277

申请日：2023-10-17

Applicant: Murata Manufacturing Co., Ltd.

Inventor： John KOULAKIS ,  Greg DYER ,  Sean MCHUGH ,  Patrick TURNER

IPC: H03H9/17 ,  H03H9/02 ,  H03H9/56

CPC classification number: H03H9/174 ,  H03H9/02228 ,  H03H9/568

Abstract: An apparatus for filtering radio frequency signals is provided. The apparatus includes a substrate and a membrane coupled to the substrate that includes piezoelectric material. The apparatus also includes an interdigital transducer (IDT) coupled to the membrane and includes a plurality of interleaved fingers. The apparatus also includes a lid, in which the membrane is arranged between the substrate and the lid with a first cavity having a first height between the lid and a first main surface of the membrane and a second cavity having a second height between the substrate and a second main surface of the membrane that opposes the first main surface. Moreover, the first height between the lid and the first main surface of the membrane is greater than a pitch of at least one pair of interleaved fingers of the plurality of interleaved fingers and at most four times greater than the second height.

公开(公告)号：US20240137004A1

公开(公告)日：2024-04-25

申请号：US18488277

申请日：2023-10-16

Applicant: Murata Manufacturing Co., Ltd.

Inventor： John KOULAKIS ,  Greg DYER ,  Sean MCHUGH ,  Patrick TURNER

IPC: H03H9/17 ,  H03H9/02 ,  H03H9/56

CPC classification number: H03H9/174 ,  H03H9/02228 ,  H03H9/568

Abstract: An apparatus for filtering radio frequency signals is provided. The apparatus includes a substrate and a membrane coupled to the substrate that includes piezoelectric material. The apparatus also includes an interdigital transducer (IDT) coupled to the membrane and includes a plurality of interleaved fingers. The apparatus also includes a lid, in which the membrane is arranged between the substrate and the lid with a first cavity having a first height between the lid and a first main surface of the membrane and a second cavity having a second height between the substrate and a second main surface of the membrane that opposes the first main surface. Moreover, the first height between the lid and the first main surface of the membrane is greater than a pitch of at least one pair of interleaved fingers of the plurality of interleaved fingers and at most four times greater than the second height.

公开(公告)号：US20250088172A1

公开(公告)日：2025-03-13

申请号：US18959780

申请日：2024-11-26

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Albert CARDONA ,  Chris O'BRIEN ,  Greg DYER

IPC: H03H9/13 ,  H03H9/02 ,  H03H9/15 ,  H03H9/17 ,  H03H9/54 ,  H03H9/56 ,  H10N30/05 ,  H10N30/06 ,  H10N30/20

Abstract: A bulk acoustic resonator is provided that includes a substrate having a surface; a piezoelectric layer attached to the surface of the substrate via a bonding oxide (BOX) layer over the surface of the substrate; a conductor pattern including an interdigital transducer (IDT) that has interleaved fingers on a surface of the piezoelectric layer; at least one contact pad disposed at a selected location over the surface of the substrate and that is electrically connected to the IDT; and an electrically isolating layer between the at least one contact pad and the surface of the substrate. Moreover, at least a portion of the piezoelectric layer is absent between the at least one contact pad and the surface of the substrate.

公开(公告)号：US20240333258A1

公开(公告)日：2024-10-03

申请号：US18616039

申请日：2024-03-25

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Luke MYERS ,  Wei YANG ,  Greg DYER

IPC: H03H9/56 ,  H03H9/02 ,  H05K1/02 ,  H05K1/16

CPC classification number: H03H9/568 ,  H03H9/02228 ,  H05K1/0233 ,  H05K1/165 ,  H05K2201/10098

Abstract: A filter is provided that a piezoelectric layer, an interdigital transducers (IDT) having interleaved fingers at the piezoelectric layer, contact pads at the piezoelectric layer and electrically coupled to the IDT, and a printed circuit board (PCB). The PCB includes a plurality of layers including at least one layer that includes a first portion and a second portion that is physically separate from the first portion with a gap therebetween. Moreover, a plurality of electrical contacts are provided on a top layer of the plurality of layers that is facing the piezoelectric layer, with the plurality of electrical contacts electrically coupled to the plurality of contact pads, respectively.

公开(公告)号：US20240154597A1

公开(公告)日：2024-05-09

申请号：US18412131

申请日：2024-01-12

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Greg DYER ,  Bryant GARCIA ,  Doug JACHOWSKI ,  Robert HAMMOND ,  Neal FENZI ,  Ryo WAKABAYASHI

IPC: H03H9/02 ,  H03H9/17 ,  H03H9/205 ,  H03H9/54

CPC classification number: H03H9/02228 ,  H03H9/02015 ,  H03H9/02133 ,  H03H9/174 ,  H03H9/205 ,  H03H9/54

Abstract: An acoustic resonator is provided that includes a substrate; a piezoelectric layer having a portion that forms a diaphragm over a cavity; and IDT on the piezoelectric layer that includes a first conductor level including first and second busbars disposed on respective portions of the piezoelectric layer, a first set of elongated fingers extending from the first bus bar onto the diaphragm, and a second set of elongated fingers extending from the second bus bar onto the diaphragm, the second set of elongated fingers interleaved with the first set of elongated fingers. The acoustic resonator also includes a second conductor level over the piezoelectric layer and covering at least portions of the first and second busbars.