公开(公告)号：US20190269010A1

公开(公告)日：2019-08-29

申请号：US16412489

申请日：2019-05-15

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Shinichi ARAKI ,  Hideyuki TAGUCHI ,  Hayato NOMA ,  Ryosuke TAKADA

IPC: H05K1/02 ,  H05K1/03 ,  H05K3/28 ,  H05K3/46

Abstract: A plate-shaped multilayer wiring substrate includes at least two resin layers stacked on top of each other and each including an insulating base and a conductive pattern provided on the insulating base, and a front surface layer joined onto the resin layers stacked. The front surface layer has a higher elastic modulus than an elastic modulus of the insulating bases. A joint interface between the resin layers and the front surface layer includes projections and depressions. Also, a method for manufacturing the plate-shaped multilayer wiring substrate includes a step of stacking, on top of resin layers, a front surface layer having a higher elastic modulus than an elastic modulus of the resin layers, and a step of performing pressing under pressure from above the front surface layer by using a flat surface in a heated state to join the resin layers and the front surface layer.

公开(公告)号：US20180242459A1

公开(公告)日：2018-08-23

申请号：US15956787

申请日：2018-04-19

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Makoto TAKEOKA ,  Masaki KAWATA ,  Tomohiko NARUOKA ,  Hayato NOMA

IPC: H05K3/28 ,  H05K3/34 ,  H05K3/46

CPC classification number: H05K3/284 ,  H01L23/29 ,  H01L23/3128 ,  H05K3/28 ,  H05K3/34 ,  H05K3/46

Abstract: A component mount board includes a resin board, an electronic component, and a molding resin. A land conductor is provided in the resin board. The electronic component is mounted on a surface of the resin board, and includes a mounting terminal that is bonded to the land conductor. The resin board includes a body resin portion including the land conductor provided on a surface thereof, and a surface resin layer disposed on a surface of the body resin portion and made of a material of the same type as that of the body resin portion. A conductor is not provided on a surface of the surface resin layer. The surface resin layer includes a through hole at which the land conductor is exposed from the surface of the resin board. The mounting terminal is bonded to the land conductor via a bonding material filled in the through hole.