公开(公告)号：US20180182680A1

公开(公告)日：2018-06-28

申请号：US15903064

申请日：2018-02-23

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kuniaki YOSUI ,  Shigeru TAGO ,  Masaki KAWATA

IPC: H01L23/12 ,  H05K1/18 ,  H05K3/46

CPC classification number: H01L23/12 ,  H01L23/145 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/50 ,  H01L2224/16225 ,  H05K1/18 ,  H05K3/46

Abstract: A resin circuit board includes a multilayer body, mounting land conductors, and second components. The multilayer body includes thermoplastic resin layers laminated together. The mounting land conductors are provided on a front surface of the multilayer body, and terminal conductors of a first component are bonded to the mounting land conductors by a thermal bonding method. The second components are disposed in the multilayer body and each has a modulus of elasticity greater than that of the multilayer body. When the multilayer body is seen in plan view, the second components are arranged such that a straight line connecting the second components passes through the center of gravity of the first component and such that the second components are superposed with the mounting land conductors.

公开(公告)号：US20160157354A1

公开(公告)日：2016-06-02

申请号：US15015475

申请日：2016-02-04

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Shigeru TAGO ,  Hirofumi SHINAGAWA ,  Yuki WAKABAYASHI ,  Kuniaki YOSUI ,  Yuki ITO ,  Toshiro ADACHI ,  Wataru YANASE ,  Masaki KAWATA

IPC: H05K1/18 ,  H05K1/02

CPC classification number: H05K1/185 ,  H05K1/0298 ,  H05K1/186 ,  H05K3/4682 ,  H05K2201/09072 ,  H05K2203/0278

Abstract: A component-embedded substrate includes a laminate and an electronic component. The electronic component is embedded in the laminate. The laminate includes a frame-shaped conductor pattern. When the laminate is viewed in a laminating direction, the frame-shaped conductor pattern is arranged so as to substantially surround the entire periphery of the electronic component. The frame-shaped conductor pattern includes a first individual conductor pattern and a second individual conductor pattern. The first individual conductor pattern and the second individual conductor pattern are separated from each other. The first individual conductor pattern is arranged close to a first external terminal electrode of the electronic component, and the second individual conductor pattern is arranged close to a second external terminal electrode of the electronic component.

Abstract translation: 部件嵌入式基板包括层叠体和电子部件。 电子部件嵌入在层压板中。 层压体包括框状导体图案。 当在层叠方向上观察层压体时，框状导体图形被布置成基本上围绕电子部件的整个周边。 框状导体图案包括第一单独导体图案和第二单独导体图案。 第一单独导体图案和第二单独导体图案彼此分离。 第一单独导体图案布置成靠近电子部件的第一外部端子电极，并且第二单独导体图案布置成靠近电子部件的第二外部端子电极。

公开(公告)号：US20160330843A1

公开(公告)日：2016-11-10

申请号：US15214611

申请日：2016-07-20

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Shigeru TAGO ,  Hirofumi SHINAGAWA ,  Masaki KAWATA ,  Yuki ITO

IPC: H05K1/18 ,  H05K1/11 ,  H05K3/32 ,  H05K1/03

CPC classification number: H05K1/181 ,  H05K1/0393 ,  H05K1/11 ,  H05K1/111 ,  H05K1/118 ,  H05K3/32 ,  H05K3/328 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/0154 ,  H05K2201/05 ,  H05K2203/0285 ,  Y02P70/611

Abstract: A module component includes a substrate including a liquid crystal polymer resin sheet, and an electronic component mounted on the substrate by ultrasonic bonding, wherein the electronic component includes a plurality of first substrate connecting electrodes including respective planar conductors provided on a substrate mounting surface separately from each other, and connected at a same potential or substantially a same potential, and the substrate includes a first component connecting electrode including a planar conductor provided on a component loading surface, and bonded to the plurality of first substrate connecting electrodes.

Abstract translation: 模块部件包括：液晶聚合物树脂片的基板和通过超声波接合安装在基板上的电子部件，其中，所述电子部件包括多个第一基板连接电极，所述第一基板连接电极包括分别设置在基板安装面上的各平面导体 彼此连接并且以相同的电位或大致相同的电位连接，并且基板包括第一部件连接电极，其包括设置在部件加载表面上的平面导体，并且接合到多个第一基板连接电极。

公开(公告)号：US20190053386A1

公开(公告)日：2019-02-14

申请号：US16161118

申请日：2018-10-16

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Masaki KAWATA ,  Yuki ITO

IPC: H05K3/46

Abstract: A resin multilayer substrate manufacturing method includes arranging a first sheet including a thermoplastic resin as a main material, arranging one or more second sheets each including a first opening and a thermoplastic resin as a main material to be stacked on the first sheet, applying heat and pressure to a multilayer body including the first sheet and the one or more second sheets in a state in which a block, with a higher rigidity than the thermoplastic resin, is inside a space formed by the first opening of one second sheet or by a series of first openings of two or more second sheets, and removing the block.

公开(公告)号：US20180242459A1

公开(公告)日：2018-08-23

申请号：US15956787

申请日：2018-04-19

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Makoto TAKEOKA ,  Masaki KAWATA ,  Tomohiko NARUOKA ,  Hayato NOMA

IPC: H05K3/28 ,  H05K3/34 ,  H05K3/46

CPC classification number: H05K3/284 ,  H01L23/29 ,  H01L23/3128 ,  H05K3/28 ,  H05K3/34 ,  H05K3/46

Abstract: A component mount board includes a resin board, an electronic component, and a molding resin. A land conductor is provided in the resin board. The electronic component is mounted on a surface of the resin board, and includes a mounting terminal that is bonded to the land conductor. The resin board includes a body resin portion including the land conductor provided on a surface thereof, and a surface resin layer disposed on a surface of the body resin portion and made of a material of the same type as that of the body resin portion. A conductor is not provided on a surface of the surface resin layer. The surface resin layer includes a through hole at which the land conductor is exposed from the surface of the resin board. The mounting terminal is bonded to the land conductor via a bonding material filled in the through hole.

公开(公告)号：US20160044798A1

公开(公告)日：2016-02-11

申请号：US14886607

申请日：2015-10-19

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Masaki KAWATA ,  Yuki ITO

IPC: H05K3/46 ,  H05K3/30

CPC classification number: H05K3/32 ,  H01L2224/16225 ,  H01L2224/81 ,  H05K1/185 ,  H05K1/186 ,  H05K3/0073 ,  H05K3/306 ,  H05K3/4611 ,  H05K3/4632 ,  H05K3/4644 ,  H05K3/4697 ,  H05K2201/0129 ,  H05K2203/061 ,  H05K2203/063

Abstract: A method of manufacturing a resin multilayer substrate is provided in which a component (3) is incorporated in a stacked body obtained by stacking a plurality of thermoplastic resin sheets (2). The method includes the steps of: softening a first resin sheet (2a) by heating, and pressing the component (3) against the first resin sheet (2a), thereby fixing the component (3) to the first resin sheet (2a); stacking the first resin sheet (2a) on a second resin sheet (2b) having a through hole (14) receiving the component (3) and a third resin sheet (2c) located adjacent to a lower side of the component (3) such that the component (3) is inserted into the through hole (14) and the lower surface of the component (3) faces the third resin sheet (2c); and performing compression bonding by heating and pressurizing the stacked body including these resin sheets (2).

Abstract translation: 提供一种制造树脂多层基板的方法，其中将组分（3）结合在通过堆叠多个热塑性树脂片（2）而获得的层叠体中。 该方法包括以下步骤：通过加热软化第一树脂片（2a），并将部件（3）压在第一树脂片（2a）上，从而将部件（3）固定到第一树脂片（2a）上。 将第一树脂片（2a）堆叠在具有容纳部件（3）的通孔（14）的第二树脂片（2b）和位于部件（3）的下侧附近的第三树脂片（2c） 组件（3）插入到通孔（14）中，并且部件（3）的下表面面向第三树脂片（2c）; 并通过对包括这些树脂片（2）的层叠体进行加热加压来进行压接。

公开(公告)号：US20160029489A1

公开(公告)日：2016-01-28

申请号：US14878287

申请日：2015-10-08

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yuki WAKABAYASHI ,  Shigeru TAGO ,  Daisuke TSURUGA ,  Masaki KAWATA

IPC: H05K1/11 ,  H05K3/32 ,  H05K3/46 ,  H05K3/00 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K1/115 ,  H03H7/0115 ,  H03H2001/0085 ,  H05K1/028 ,  H05K1/0298 ,  H05K1/165 ,  H05K1/186 ,  H05K3/0064 ,  H05K3/0094 ,  H05K3/32 ,  H05K3/3484 ,  H05K3/4617 ,  H05K3/4697 ,  H05K2201/0141 ,  H05K2201/09263 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2203/046 ,  H05K2203/063 ,  H05K2203/1484 ,  Y02P70/611

Abstract: A component-embedded substrate includes a cavity including through-holes penetrating through resin sheets in a stacked body of resin sheets having flexibility. An electronic chip component including external electrodes is disposed in the cavity. The resin sheet on which the electronic chip component is located is provided with through-holes into which conductive pastes are filled. The resin sheet includes cut-away portions communicating with a through-hole and located at a distance from each other across the through-hole. When this stacked body is hot-pressed, the conductive pastes overflow from the through-holes. However, the overflowing conductive pastes enter the cut-away portions.

Abstract translation: 组件嵌入式基板包括具有穿透树脂片的通孔的空腔，该树脂片具有柔性的树脂片层叠体。 包括外部电极的电子芯片组件设置在空腔中。 电子芯片部件所在的树脂片设置有填充有导电性糊剂的贯通孔。 树脂片包括与通孔连通并且穿过通孔彼此相距一定距离的切除部分。 当该堆叠体被热压时，导电浆料从通孔溢出。 然而，溢出的导电浆料进入切割部分。