公开(公告)号：US20240039515A1

公开(公告)日：2024-02-01

申请号：US18333653

申请日：2023-06-13

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yuji TAKEMATSU ,  Tetsuro HARADA ,  Hiroaki TAKAOKA ,  Hiroki DEGUCHI

IPC: H03H9/64 ,  H04B1/04

CPC classification number: H03H9/6423 ,  H04B1/04

Abstract: A radio frequency module includes a module substrate, a plurality of passive components disposed on a main surface of the module substrate, and a filter component disposed over the plurality of passive components, wherein the filter component includes series arm resonators that constitute an acoustic wave filter, the series arm resonator is connected between the series arm resonators, and a region of the filter component formed with the series arm resonator does not overlap the plurality of passive components and at least a part of the other region of the filter component overlaps at least a part of each of the plurality of passive components in a plan view of the module substrate.

公开(公告)号：US20240080061A1

公开(公告)日：2024-03-07

申请号：US18487905

申请日：2023-10-16

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Hiroki DEGUCHI

IPC: H04B1/40

CPC classification number: H04B1/40 ,  H01Q1/38

Abstract: A radio-frequency module includes a mounting board, an electronic component and an external connection terminal, a resin layer, and an insulating layer. The electronic component and the external connection terminal are disposed at a second major surface of the mounting board. The insulating layer is harder than the resin layer. A third major surface of the electronic components is located between a fourth major surface of the electronic component and the second major surface. The insulating layer is disposed over the fourth major surface of the electronic component or over both the fourth major surface of the electronic component and the resin layer.