公开(公告)号：US20250080143A1

公开(公告)日：2025-03-06

申请号：US18780829

申请日：2024-07-23

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Keisuke ARIMA ,  Kazuma SUGIURA ,  Hiroaki TAKAOKA

IPC: H04B1/00 ,  H04B1/44

Abstract: A high frequency module includes a low noise amplifier, a switch, a first inductor, a second inductor, a first filter, and a second filter. The first inductor is connected between the low noise amplifier and an output terminal of the switch. The second inductor is connected between a path between the first inductor and the output terminal of the switch, and an input/output terminal of the switch. The switch is configured to switch between a first state where a first input terminal connected to the first filter and the output terminal are connected, and the input/output terminal and a ground terminal are connected, and a second state where a second input terminal connected to the second filter and the input/output terminal are connected.

公开(公告)号：US20240039515A1

公开(公告)日：2024-02-01

申请号：US18333653

申请日：2023-06-13

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yuji TAKEMATSU ,  Tetsuro HARADA ,  Hiroaki TAKAOKA ,  Hiroki DEGUCHI

IPC: H03H9/64 ,  H04B1/04

CPC classification number: H03H9/6423 ,  H04B1/04

Abstract: A radio frequency module includes a module substrate, a plurality of passive components disposed on a main surface of the module substrate, and a filter component disposed over the plurality of passive components, wherein the filter component includes series arm resonators that constitute an acoustic wave filter, the series arm resonator is connected between the series arm resonators, and a region of the filter component formed with the series arm resonator does not overlap the plurality of passive components and at least a part of the other region of the filter component overlaps at least a part of each of the plurality of passive components in a plan view of the module substrate.

公开(公告)号：US20230319984A1

公开(公告)日：2023-10-05

申请号：US18332251

申请日：2023-06-09

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Tetsuro HARADA ,  Dai NAKAGAWA ,  Yuji TAKEMATSU ,  Hiroaki TAKAOKA ,  Takahisa TOYOMURA

IPC: H05K1/02

CPC classification number: H05K1/0243 ,  H05K2201/1003 ,  H05K2201/10098

Abstract: Detection accuracy is improved with a reduced size. A radio-frequency module includes an antenna terminal, a signal input terminal, a signal output terminal, a mounting substrate, a chip inductor, and a directional coupler. The mounting substrate has a first major surface and a second major surface opposite to each other. The chip inductor is mounted on the first major surface of the mounting substrate. The chip inductor is provided in at least one of a transmitting path between the antenna terminal and the signal input terminal and a receiving path between the antenna terminal and the signal output terminal. The directional coupler is mounted on the second major surface of the mounting substrate, and at least part of the directional coupler is provided in the transmitting path.