RADIO FREQUENCY MODULE
    1.
    发明公开

    公开(公告)号:US20240039515A1

    公开(公告)日:2024-02-01

    申请号:US18333653

    申请日:2023-06-13

    CPC classification number: H03H9/6423 H04B1/04

    Abstract: A radio frequency module includes a module substrate, a plurality of passive components disposed on a main surface of the module substrate, and a filter component disposed over the plurality of passive components, wherein the filter component includes series arm resonators that constitute an acoustic wave filter, the series arm resonator is connected between the series arm resonators, and a region of the filter component formed with the series arm resonator does not overlap the plurality of passive components and at least a part of the other region of the filter component overlaps at least a part of each of the plurality of passive components in a plan view of the module substrate.

    RADIO-FREQUENCY MODULE AND COMMUNICATION DEVICE

    公开(公告)号:US20230319984A1

    公开(公告)日:2023-10-05

    申请号:US18332251

    申请日:2023-06-09

    CPC classification number: H05K1/0243 H05K2201/1003 H05K2201/10098

    Abstract: Detection accuracy is improved with a reduced size. A radio-frequency module includes an antenna terminal, a signal input terminal, a signal output terminal, a mounting substrate, a chip inductor, and a directional coupler. The mounting substrate has a first major surface and a second major surface opposite to each other. The chip inductor is mounted on the first major surface of the mounting substrate. The chip inductor is provided in at least one of a transmitting path between the antenna terminal and the signal input terminal and a receiving path between the antenna terminal and the signal output terminal. The directional coupler is mounted on the second major surface of the mounting substrate, and at least part of the directional coupler is provided in the transmitting path.

    HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE

    公开(公告)号:US20230103162A1

    公开(公告)日:2023-03-30

    申请号:US17817383

    申请日:2022-08-04

    Inventor: Tetsuro HARADA

    Abstract: A high frequency module includes a mounting substrate, an inductor, and a plurality of electronic components. The inductor is arranged on the mounting substrate. The inductor is arranged in an inside of the mounting substrate and has a winding portion formed by winding a conductor portion a plurality of times in a thickness direction of the mounting substrate. A first ground layer is formed in a region that is on an inner side of an outer edge of the winding portion in plan view of the mounting substrate, and the first ground layer is arranged closest to the winding portion in the thickness direction of the mounting substrate among ground layers formed in the region in a plurality of ground layers. The first ground layer is overlapped with an inner region but is not overlapped with at least part of the winding portion in plan view of the mounting substrate.

    HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE

    公开(公告)号:US20190222237A1

    公开(公告)日:2019-07-18

    申请号:US16364527

    申请日:2019-03-26

    Inventor: Tetsuro HARADA

    Abstract: In a high frequency module, a first band processing circuit, a second band processing circuit, and a third band processing circuit. The first band processing circuit is used at the same time as the third band processing circuit (D3) when wireless communication is performed. A frequency of a harmonic of a first transmission signal of the first band processing circuit is included in a frequency band of a third reception signal of the third band processing circuit. The second band processing circuit is not used at the same time as the first band processing circuit and the third band processing circuit (D3) when wireless communication is performed and is disposed between the first band processing circuit and the third band processing circuit in a plan view of the substrate.

    RADIO FREQUENCY MODULE
    6.
    发明申请

    公开(公告)号:US20210006283A1

    公开(公告)日:2021-01-07

    申请号:US17022369

    申请日:2020-09-16

    Inventor: Tetsuro HARADA

    Abstract: A radio frequency module is provided. A matching circuit includes an inductor which is connected in series to the power amplifier and is formed in a substrate. The substrate includes a ground layer, a low permittivity portion, and a high permittivity portion. The ground layer at least partially overlaps with a first input terminal of the low-noise amplifier in a plan view from a thickness direction of the substrate. The low permittivity portion at least partially overlaps with the first input terminal in a plan view from the thickness direction, and is provided between the first input terminal and the ground layer. The high permittivity portion is in contact with the inductor and has the permittivity greater than the permittivity of the low permittivity portion.

    RADIO-FREQUENCY MODULE, TRANSMISSION POWER AMPLIFIER, AND COMMUNICATION APPARATUS

    公开(公告)号:US20210226652A1

    公开(公告)日:2021-07-22

    申请号:US17224154

    申请日:2021-04-07

    Abstract: A radio-frequency module includes a mounting substrate having a first main surface and a second main surface on opposite sides of the mounting substrate; an external connection terminal arranged on the first main surface; and a first transmission power amplifier arranged on the first main surface. The first transmission power amplifier includes an amplifier first main surface closest to the first main surface, an amplifier second main surface that faces away from the amplifier first main surface, a first input-output electrode arranged on the amplifier first main surface and through which a radio-frequency signal input into the first transmission power amplifier or a radio-frequency signal output from the first transmission power amplifier is transmitted, and a first ground electrode arranged on the amplifier second main surface.

    HIGH FREQUENCY CIRCUIT MODULE
    9.
    发明申请
    HIGH FREQUENCY CIRCUIT MODULE 有权
    高频电路模块

    公开(公告)号:US20150118984A1

    公开(公告)日:2015-04-30

    申请号:US14485857

    申请日:2014-09-15

    CPC classification number: H04B1/18 H04B1/0458

    Abstract: A high frequency circuit module includes a variable inductance circuit portion and a reactance circuit portion. The variable inductance circuit portion is connected between an antenna port and ground. The variable reactance circuit is connected between the antenna port and a front-end port. The variable inductance circuit portion includes a first inductor, a second inductor, and a switch. The first inductor is connected between the antenna port and the ground. The second inductor and the switch are connected in series, and this series circuit is connected in parallel to the first inductor.

    Abstract translation: 高频电路模块包括可变电感电路部分和电抗电路部分。 可变电感电路部分连接在天线端口和地之间。 可变电抗电路连接在天线端口和前端口之间。 可变电感电路部分包括第一电感器,第二电感器和开关。 第一个电感连接在天线端口和地之间。 第二电感和开关串联连接,该串联电路与第一电感并联。

    RADIO FREQUENCY MODULE AND COMMUNICATION DEVICE

    公开(公告)号:US20210219419A1

    公开(公告)日:2021-07-15

    申请号:US17216722

    申请日:2021-03-30

    Abstract: A radio frequency module includes: a first mounting board having a first principal surface and a second principal surface; a second mounting board having a third principal surface facing the second principal surface and a fourth principal surface; a transmission filter having a first mounting surface facing the second principal surface and a first top surface; and a reception filter having a second mounting surface facing the third principal surface and a second top surface; wherein the transmission and reception filters overlap at least partially in a plan view of the first and second mounting boards, an output terminal of the transmission filter is arranged on the first top surface, an input terminal of the reception filter is arranged on the second top surface, and the output and input terminals are connected by a conductive member not routed through the first mounting board or the second mounting board.

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