公开(公告)号：US20190311842A1

公开(公告)日：2019-10-10

申请号：US16373548

申请日：2019-04-02

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Katsuhisa IMADA ,  Keiichi YOSHINAKA ,  Keishiro AMAYA ,  Hiroyuki KANBARA

IPC: H01F27/29 ,  H01F41/10 ,  H01F27/32

Abstract: A coil component including an element assembly that contains a filler and a resin material, a coil portion composed of a coil conductor that is embedded in the element assembly, and a pair of outer electrodes electrically connected to the coil conductor. Also, the coil conductor is covered with a glass layer.

公开(公告)号：US20240153690A1

公开(公告)日：2024-05-09

申请号：US18410014

申请日：2024-01-11

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Rikiya SANO ,  Hiroyuki KANBARA

IPC: H01F17/00 ,  H01F27/28 ,  H01F27/32 ,  H01F41/04 ,  H05K3/12

CPC classification number: H01F17/0013 ,  H01F27/2804 ,  H01F27/32 ,  H01F41/041 ,  H05K3/12 ,  H01F2017/004 ,  H01F2027/2809

Abstract: An inductor component comprising an element body; a helically wound coil disposed in the element body; and an external electrode disposed in the element body and electrically connected to the coil. The element body includes a plurality of insulating layers and a mark layer constituting a portion of an outer surface of the element body, and a K abundance ratio (atom %) in the mark layer is higher than a K abundance ratio (atom %) in the insulating layers.

公开(公告)号：US20200373063A1

公开(公告)日：2020-11-26

申请号：US16854336

申请日：2020-04-21

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Keiichi YOSHINAKA ,  Masahiro HAYASHI ,  Hiroyuki KANBARA

IPC: H01F27/28 ,  H01F27/29 ,  H01F27/32 ,  H01F41/04 ,  H01F41/12

Abstract: The present disclosure provides a coil component including an element assembly containing a filler and a resin material, a coil portion composed of a coil conductor embedded in the element assembly, and a pair of outer electrodes electrically coupled to the coil conductor. A relatively thin first conductor layer and a relatively thick second conductor layer are stacked in the coil conductor.

公开(公告)号：US20200381159A1

公开(公告)日：2020-12-03

申请号：US16843686

申请日：2020-04-08

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Rikiya SANO ,  Hiroyuki KANBARA

IPC: H01F17/00 ,  H01F27/28 ,  H01F41/04 ,  H05K3/12 ,  H01F27/32

Abstract: An inductor component comprising an element body; a helically wound coil disposed in the element body; and an external electrode disposed in the element body and electrically connected to the coil. The element body includes a plurality of insulating layers and a mark layer constituting a portion of an outer surface of the element body, and a K abundance ratio (atom%) in the mark layer is higher than a K abundance ratio (atom%) in the insulating layers.

公开(公告)号：US20190112222A1

公开(公告)日：2019-04-18

申请号：US16219878

申请日：2018-12-13

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Hiroyuki KANBARA

IPC: C03C4/04 ,  C03C8/16 ,  C03C8/24 ,  C03C8/02 ,  G03F7/004 ,  H05K1/03 ,  G03F7/029

Abstract: A photosensitive glass paste contains a photosensitive organic component, and an inorganic component containing a glass powder and a ceramic filler. The glass powder contains a glass powder having a crystallization point. The difference between the crystallization point and the softening point of the glass powder having a crystallization point is from 85° C. to 180° C. The glass powder having a crystallization point is preferably a SiO2—B2O3—BaO—ZnO—Al2O3—MgO—La2O3 glass powder.

公开(公告)号：US20180220529A1

公开(公告)日：2018-08-02

申请号：US15937692

申请日：2018-03-27

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Hiroyuki KANBARA

IPC: H05K1/03 ,  C03C8/22 ,  H05K3/46

CPC classification number: H05K1/0306 ,  C03C3/062 ,  C03C3/089 ,  C03C4/04 ,  C03C8/22 ,  C03C8/24 ,  C03C14/006 ,  C03C2214/16 ,  G03F7/0047 ,  G03F7/029 ,  G03F7/031 ,  G03F7/033 ,  H01B3/02 ,  H05K1/03 ,  H05K3/46 ,  H05K2201/0104 ,  H05K2201/017 ,  H05K2201/068 ,  H05K2203/1126

Abstract: A photosensitive glass paste contains a photosensitive organic component and an inorganic component containing a glass powder having a high softening point, a glass powder having a low softening point, and a ceramic filler. The ceramic filler has a thermal expansion coefficient of 10×10−6/° C. to 16×10−6/° C., the inorganic component contains 30% to 50% by volume of the ceramic filler, and the inorganic component contains 0.5% to 10% by volume of the glass powder having a low softening point.