公开(公告)号：US20190311842A1

公开(公告)日：2019-10-10

申请号：US16373548

申请日：2019-04-02

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Katsuhisa IMADA ,  Keiichi YOSHINAKA ,  Keishiro AMAYA ,  Hiroyuki KANBARA

IPC: H01F27/29 ,  H01F41/10 ,  H01F27/32

Abstract: A coil component including an element assembly that contains a filler and a resin material, a coil portion composed of a coil conductor that is embedded in the element assembly, and a pair of outer electrodes electrically connected to the coil conductor. Also, the coil conductor is covered with a glass layer.

公开(公告)号：US20130222105A1

公开(公告)日：2013-08-29

申请号：US13766379

申请日：2013-02-13

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Satoki SAKAI ,  Keishiro AMAYA ,  Eita TAMEZAWA

IPC: H01F5/00

CPC classification number: H01F5/003 ,  H01F17/0013 ,  H01F2017/002

Abstract: Provided is an electronic component that can suppress the occurrence of disconnections between line conductor layers and via hole conductors and a method of manufacturing the electronic component. A multilayer body is formed by stacking insulating layers. A conductor layer is provided on a first insulating layer. A line conductor layer is provided on a second insulating layer that is provided on an upper side of the first insulating layer in a stacking (z-axis) direction. A via hole conductor connects an end portion of the line conductor layer to the conductor layer and extends through the second insulating layer in the z-axis direction. In the via hole conductor, a connection surface connected to the line conductor layer is formed of a circular portion and a protrusion. The protrusion protrudes from the circular portion in the x-axis direction in which the line conductor layer extends from the end portion.

Abstract translation: 提供一种可以抑制线路导体层和通孔导体之间的断开的发生的电子部件和制造电子部件的方法。 通过堆叠绝缘层形成多层体。 导体层设置在第一绝缘层上。 线路导体层设置在层叠（z轴）方向上设置在第一绝缘层的上侧的第二绝缘层上。 通孔导体将导线层的端部与导体层连接，并且在z轴方向上延伸穿过第二绝缘层。 在通孔导体中，连接到线路导体层的连接表面由圆形部分和突起形成。 该突出部从线状导体层从端部部延伸的x轴方向的圆形部突出。