公开(公告)号：US20190229027A1

公开(公告)日：2019-07-25

申请号：US16374022

申请日：2019-04-03

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kaneo NOMIYAMA ,  Kazushige SATO ,  Yuya ESHITA ,  Nobumitsu AMACHI

IPC: H01L23/31 ,  H01F27/28 ,  H01F27/02 ,  H01G2/10 ,  H01G4/30

Abstract: A circuit module includes: a substrate including a wiring pattern; a first region in which a first electronic component is mounted on one major surface of the substrate; a second region in which a second electronic component, which is taller than the first electronic component, is mainly mounted on the one major surface of the substrate; a first conductor provided in the first region and electrically connected with the wiring pattern; and sealing resin that seals the first electronic component, the second electronic component, and the first conductor. Sealing resin sealing the first region is formed to be shorter than sealing resin sealing the second region, part of the first conductor is exposed on a surface of the sealing resin, wiring is formed on the surface of the sealing resin, and the first conductor the part of which is exposed is electrically connected with the wiring.