公开(公告)号：US20190318973A1

公开(公告)日：2019-10-17

申请号：US16454302

申请日：2019-06-27

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Ken OKADA ,  Kazushige SATO ,  Shingo FUNAKAWA ,  Katsuhiko FUJIKAWA ,  Nobumitsu AMACHI

IPC: H01L23/29 ,  H01L23/31 ,  H01L23/495 ,  H01L23/538 ,  H01L25/10 ,  H01L23/36 ,  H03H9/25 ,  H05K1/02

Abstract: A circuit module (101) includes a substrate (1) having a principal surface (1a), a first component (6) mounted on the principal surface (1a), and a sealing resin portion (3) that covers at least a side surface of the first component (6) while covering the principal surface (1a). The first component (6) includes an empty portion (6c) and a connection portion (6b) exposed to the empty portion (6c). The sealing resin portion (3) is arranged to avoid at least a part of a region that is included in an upper surface of the first component (6) and corresponds to the empty portion (6c).

公开(公告)号：US20190181068A1

公开(公告)日：2019-06-13

申请号：US16278381

申请日：2019-02-18

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Shingo FUNAKAWA ,  Nobumitsu AMACHI

IPC: H01L23/31 ,  H01L23/538 ,  H01L21/56 ,  H01L23/00

Abstract: A circuit module includes a flat substrate, a frame substrate, a first electronic component, and a first sealing member. First connection electrodes are disposed at a peripheral portion of one main surface of the flat substrate. Second connection electrodes are disposed on one main surface of the frame substrate at locations corresponding to the first connection electrodes. Each of the first connection electrodes and a corresponding one of the second connection electrodes are connected to each other via a first connection member. The first electronic component is sealed by the first sealing member. The first electronic component and the first sealing member are disposed in a cavity defined by the one main surface of the flat substrate and an inner surface of the frame substrate. The first sealing member is separated from the inner surface of the frame substrate.

公开(公告)号：US20200058599A1

公开(公告)日：2020-02-20

申请号：US16662615

申请日：2019-10-24

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takahiro OKADA ,  Kazushige SATO ,  Takafumi KANNO ,  Nobumitsu AMACHI

IPC: H01L23/552 ,  H01L23/498 ,  H01L23/31 ,  H01L23/00 ,  H01L21/56 ,  H01G4/38 ,  H01G4/224 ,  H01L21/48

Abstract: A circuit module (101) includes a circuit board (1) having a main surface (1u), an electronic component (3) mounted on the main surface (1u), and a sealing resin (4) covering at least part of the electronic component (3) on the main surface (1u). A recess (7) is formed on at least part of a side surface (11) of the sealing resin (4). At least the recess (7) is covered with an electrically conductive film (6).

公开(公告)号：US20190229027A1

公开(公告)日：2019-07-25

申请号：US16374022

申请日：2019-04-03

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kaneo NOMIYAMA ,  Kazushige SATO ,  Yuya ESHITA ,  Nobumitsu AMACHI

IPC: H01L23/31 ,  H01F27/28 ,  H01F27/02 ,  H01G2/10 ,  H01G4/30

Abstract: A circuit module includes: a substrate including a wiring pattern; a first region in which a first electronic component is mounted on one major surface of the substrate; a second region in which a second electronic component, which is taller than the first electronic component, is mainly mounted on the one major surface of the substrate; a first conductor provided in the first region and electrically connected with the wiring pattern; and sealing resin that seals the first electronic component, the second electronic component, and the first conductor. Sealing resin sealing the first region is formed to be shorter than sealing resin sealing the second region, part of the first conductor is exposed on a surface of the sealing resin, wiring is formed on the surface of the sealing resin, and the first conductor the part of which is exposed is electrically connected with the wiring.

公开(公告)号：US20190208494A1

公开(公告)日：2019-07-04

申请号：US16297912

申请日：2019-03-11

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Nobumitsu AMACHI ,  Tetsu NISHIMURA

IPC: H04W64/00 ,  H04B17/318 ,  H04W4/02

CPC classification number: H04W64/003 ,  G01S5/14 ,  H04B17/318 ,  H04W4/023 ,  H04W64/00 ,  H04W84/18

Abstract: A location estimation system includes non-directional stationary devices having respective non-directional antennas configured to receive a radio signal transmitted by a mobile device; and directional stationary devices having respective directional antennas configured to receive a radio signal transmitted by the mobile device. The non-directional stationary devices output, as pieces of location estimation information for estimating a location of the mobile device, pieces of information indicating received signal strength indicators of the received radio signal. The directional stationary devices output, as pieces of complementary information for identifying a non-directional stationary device used for location estimation from among the non-directional stationary devices, pieces of information indicating received signal strength indicators of the received radio signal.

公开(公告)号：US20190334250A1

公开(公告)日：2019-10-31

申请号：US16507309

申请日：2019-07-10

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Shigeyuki KAMIO ,  Nobumitsu AMACHI

IPC: H01Q21/06 ,  H01Q1/48 ,  H01Q1/22

Abstract: A base part (110) has one main surface (111) that is spherically curved so as to protrude outward and another main surface (112) that is flat. A plurality of antenna elements (130) are provided along the one main surface (111) inside the base part (110). A plurality of connection wiring lines (150) connect the plurality of connection terminals (120) and the plurality of antenna elements (130) to each other. A part of each of the plurality of connection wiring lines (150) disposed in a region where a ground wiring line (140) is provided extends in a direction perpendicular to the other main surface (112) when viewed in a direction perpendicular to the other main surface (112).

公开(公告)号：US20190200357A1

公开(公告)日：2019-06-27

申请号：US16286972

申请日：2019-02-27

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Koudai YOKOTE ,  Hiroyuki NIWA ,  Toshihiro HOSOKAWA ,  Suguya IBARAKI ,  Takuya KIDERA ,  Takayuki HORIBE ,  Ryuhei NAKAI ,  Nobumitsu AMACHI

IPC: H04W72/04

CPC classification number: H04W72/0453 ,  H01Q1/24 ,  H01Q1/52 ,  H04B1/00 ,  H04B1/40

Abstract: A wireless communication device (50) includes a housing (51) and a first board (52) placed inside the housing (51). On the first board (52) there is mounted a first communication circuit (61a) and a first antenna (61b) that perform wireless communication based on a first wireless communication system that uses a first frequency band and a second communication circuit (62a) and a second antenna (62b) that perform wireless communication based on a second wireless communication system that uses the first frequency band and is different from the first wireless communication system. The first antenna (61b) and the second antenna (62b) are respectively placed in a first region and a second region that are in a diagonal spatial relationship in plan view of the first board (52).

公开(公告)号：US20190157773A1

公开(公告)日：2019-05-23

申请号：US16251618

申请日：2019-01-18

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yuichi ITO ,  Masahiro IZAWA ,  Masayuki KOBAYASHI ,  Nobumitsu AMACHI

IPC: H01Q23/00 ,  H01Q9/04 ,  H01Q5/335 ,  H01Q25/04

Abstract: An antenna (101) includes a grounded conductive foil (110) disposed on a module substrate (140), a first conductive foil (111), and a second conductive foil (112). The first conductive foil (111) and the second conductive foil (112) are disposed on the module substrate (140), are elongated, and do not overlap with the grounded conductive foil (110) in a plan view of the module substrate (140). The first conductive foil (111) has one end supplied with an antenna signal and the other end that is open. The second conductive foil (112) has one end connected to the grounded conductive foil (110) and the other end that is open. A wireless module (120) includes a circuit unit (130) including a communication circuit and provided to the module substrate (140) on which the antenna (101) is formed.

公开(公告)号：US20190215993A1

公开(公告)日：2019-07-11

申请号：US16299328

申请日：2019-03-12

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshikazu YAGI ,  Kazushige SATO ,  Akihiro HARA ,  Noboru MORIOKA ,  Nobumitsu AMACHI

IPC: H05K9/00 ,  H01L23/02 ,  H01L23/552 ,  H05K1/02 ,  H05K1/18 ,  H05K5/02 ,  H05K3/32

Abstract: A high-frequency component includes a wiring substrate, a component mounted on an upper surface of the wiring substrate, a columnar member formed of a conductive resin and standing on the upper surface of the wiring substrate in a state of a lower end portion of the columnar member being fixed to the upper surface of the wiring substrate, and a shield case covering the component and the columnar member. The shield case has a lid plate disposed so as to face the upper surface of the wiring substrate and a side plate extending from an edge of the lid plate toward the upper surface of the wiring substrate, and an upper end portion of the columnar member is fixed to each of four corner portions of the lid plate, when viewed in a direction perpendicular to the upper surface of the wiring substrate.

公开(公告)号：US20180294580A1

公开(公告)日：2018-10-11

申请号：US16003141

申请日：2018-06-08

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takayuki HORIBE ,  Nobumitsu AMACHI ,  Masayuki KOBAYASHI ,  Masahiro IZAWA

IPC: H01Q21/30 ,  H01Q1/38 ,  H01Q1/48 ,  H01Q9/26

CPC classification number: H01Q21/30 ,  H01Q1/38 ,  H01Q1/48 ,  H01Q5/321 ,  H01Q5/328 ,  H01Q9/26 ,  H01Q9/42 ,  H01Q21/28

Abstract: An antenna element includes an antenna board, a radiation conductor including radiation portions including a top surface portion and being divided at positions corresponding to frequency bands and provided with respect to a first feeding point in plan view of the antenna board, through-conductors penetrating the antenna board at respective positions of end portions of the top surface portion in a thickness direction, and bottom surface electrodes provided on a bottom surface of the antenna board opposite the end portions of the top surface portion, and connected to the top surface portion via the through-conductors.