公开(公告)号：US20190215993A1

公开(公告)日：2019-07-11

申请号：US16299328

申请日：2019-03-12

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshikazu YAGI ,  Kazushige SATO ,  Akihiro HARA ,  Noboru MORIOKA ,  Nobumitsu AMACHI

IPC: H05K9/00 ,  H01L23/02 ,  H01L23/552 ,  H05K1/02 ,  H05K1/18 ,  H05K5/02 ,  H05K3/32

Abstract: A high-frequency component includes a wiring substrate, a component mounted on an upper surface of the wiring substrate, a columnar member formed of a conductive resin and standing on the upper surface of the wiring substrate in a state of a lower end portion of the columnar member being fixed to the upper surface of the wiring substrate, and a shield case covering the component and the columnar member. The shield case has a lid plate disposed so as to face the upper surface of the wiring substrate and a side plate extending from an edge of the lid plate toward the upper surface of the wiring substrate, and an upper end portion of the columnar member is fixed to each of four corner portions of the lid plate, when viewed in a direction perpendicular to the upper surface of the wiring substrate.

公开(公告)号：US20230163454A1

公开(公告)日：2023-05-25

申请号：US18099973

申请日：2023-01-23

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kazushige SATO ,  Kengo ONAKA ,  Hirotsugu MORI

IPC: H01Q1/40 ,  H01Q5/10 ,  H01Q9/04 ,  H01Q21/08

CPC classification number: H01Q1/40 ,  H01Q5/10 ,  H01Q9/0407 ,  H01Q21/08

Abstract: A communication device includes a dielectric substrate, a radiating element that has a flat shape and that is formed on the dielectric substrate, a housing that covers the dielectric substrate, and a rib. The rib is disposed in contact with the housing and the dielectric substrate. Feed points to which a radio frequency signal from an RFIC is supplied are formed in the radiating element. The rib and the dielectric substrate are in contact with each other in a center side region of the radiating element relative to the feed points, in a plan view from a normal direction of the dielectric substrate.

公开(公告)号：US20190318974A1

公开(公告)日：2019-10-17

申请号：US16451825

申请日：2019-06-25

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Katsuhiko FUJIKAWA ,  Shingo FUNAKAWA ,  Kazushige SATO ,  Nobumitsu AMACHI

IPC: H01L23/31 ,  H01L23/29 ,  H01L23/36 ,  H01L23/495 ,  H01L25/065 ,  H05K3/36

Abstract: A circuit module (301) includes a first substrate (201), a first module (101), a sealing resin portion (3), and a conductive material film (7). The first substrate (201) has a first principal surface (201a). The first module (101) is mounted on the first principal surface (201a). The sealing resin portion (3) is formed on the first principal surface (201a) and covers the first module (101). The conductive material film (7) covers a side of the sealing resin portion (3). The first module (101) includes a conductive material portion and a device which may produce heat and which is mounted on the conductive material portion. The conductive material portion connects with the conductive material film (7) on the side of the sealing resin portion (3).

公开(公告)号：US20200058599A1

公开(公告)日：2020-02-20

申请号：US16662615

申请日：2019-10-24

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takahiro OKADA ,  Kazushige SATO ,  Takafumi KANNO ,  Nobumitsu AMACHI

IPC: H01L23/552 ,  H01L23/498 ,  H01L23/31 ,  H01L23/00 ,  H01L21/56 ,  H01G4/38 ,  H01G4/224 ,  H01L21/48

Abstract: A circuit module (101) includes a circuit board (1) having a main surface (1u), an electronic component (3) mounted on the main surface (1u), and a sealing resin (4) covering at least part of the electronic component (3) on the main surface (1u). A recess (7) is formed on at least part of a side surface (11) of the sealing resin (4). At least the recess (7) is covered with an electrically conductive film (6).

公开(公告)号：US20190229027A1

公开(公告)日：2019-07-25

申请号：US16374022

申请日：2019-04-03

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kaneo NOMIYAMA ,  Kazushige SATO ,  Yuya ESHITA ,  Nobumitsu AMACHI

IPC: H01L23/31 ,  H01F27/28 ,  H01F27/02 ,  H01G2/10 ,  H01G4/30

Abstract: A circuit module includes: a substrate including a wiring pattern; a first region in which a first electronic component is mounted on one major surface of the substrate; a second region in which a second electronic component, which is taller than the first electronic component, is mainly mounted on the one major surface of the substrate; a first conductor provided in the first region and electrically connected with the wiring pattern; and sealing resin that seals the first electronic component, the second electronic component, and the first conductor. Sealing resin sealing the first region is formed to be shorter than sealing resin sealing the second region, part of the first conductor is exposed on a surface of the sealing resin, wiring is formed on the surface of the sealing resin, and the first conductor the part of which is exposed is electrically connected with the wiring.

公开(公告)号：US20220007499A1

公开(公告)日：2022-01-06

申请号：US17480429

申请日：2021-09-21

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kazuya OKAMOTO ,  Takashi HAGA ,  Masayoshi TAKAGI ,  Kazushige SATO

IPC: H05K1/02 ,  H01R12/52 ,  H01R13/52

Abstract: A module according to the present disclosure includes a circuit board, an electronic component on one of two principal surfaces of the circuit board, a connection conductor on the principal surface of the circuit board, and sealing resin on the principal surface of the circuit board. The electronic component and the connection conductor are covered with the sealing resin. The connection conductor includes a plate-shaped conductor and terminal sections. The plate-shaped conductor is disposed upright on the principal surface of the circuit board. The terminal sections extend from the plate-shaped conductor and away from the principal surface of the circuit board and are arranged side by side. Tip portions of the terminal sections are exposed at a surface of the sealing resin.

公开(公告)号：US20210280503A1

公开(公告)日：2021-09-09

申请号：US17327821

申请日：2021-05-24

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kazushige SATO ,  Masayoshi TAKAGI

IPC: H01L23/498 ,  H01L23/60 ,  H01L25/065 ,  H01L23/31

Abstract: A module includes: a substrate including a first main surface; a first component mounted on the first main surface; a first land electrode provided on the first main surface; a first mold resin that covers at least the first main surface and the first component; a top surface shield film that covers a top surface of the first mold resin; a side surface shield film that covers a side surface of the first mold resin; a first conductor pillar provided in the first mold resin to electrically connect the first land electrode and the top surface shield film; and an upper first bypass conductor provided in the first mold resin to electrically connect the top surface shield film and the side surface shield film.

公开(公告)号：US20190318973A1

公开(公告)日：2019-10-17

申请号：US16454302

申请日：2019-06-27

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Ken OKADA ,  Kazushige SATO ,  Shingo FUNAKAWA ,  Katsuhiko FUJIKAWA ,  Nobumitsu AMACHI

IPC: H01L23/29 ,  H01L23/31 ,  H01L23/495 ,  H01L23/538 ,  H01L25/10 ,  H01L23/36 ,  H03H9/25 ,  H05K1/02

Abstract: A circuit module (101) includes a substrate (1) having a principal surface (1a), a first component (6) mounted on the principal surface (1a), and a sealing resin portion (3) that covers at least a side surface of the first component (6) while covering the principal surface (1a). The first component (6) includes an empty portion (6c) and a connection portion (6b) exposed to the empty portion (6c). The sealing resin portion (3) is arranged to avoid at least a part of a region that is included in an upper surface of the first component (6) and corresponds to the empty portion (6c).