CHIP-SHAPED ELECTRONIC COMPONENT
    1.
    发明申请

    公开(公告)号:US20180068792A1

    公开(公告)日:2018-03-08

    申请号:US15480511

    申请日:2017-04-06

    CPC classification number: H01G4/248 H01B1/02 H01G4/12 H01G4/232 H01G4/30

    Abstract: An external electrode includes an underlying electrode layer on an end surface of a ceramic body and connected to an internal electrode, an external electrode layer located outside the underlying electrode layer, and an intermediate electrode layer including at least a portion between the underlying electrode layer and the external electrode layer. The intermediate electrode layer includes a conductive resin, and the underlying electrode layer and the external electrode layer include a material lower in electrical resistivity than the conductive resin. The intermediate electrode layer entirely or substantially entirely covers the end surfaces and extends from the end surfaces to portions, respectively, of one main surface, and the underlying electrode layer is partially exposed from the intermediate electrode layer to include an exposed surface and is in surface-contact with the external electrode layer at the exposed surface.

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