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公开(公告)号：US20190221511A1
公开(公告)日：2019-07-18
申请号：US16361277
申请日：2019-03-22
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Keito YONEMORI
IPC: H01L23/498 , H01F27/28 , H01F27/32 , H02M3/04
CPC classification number: H01L23/49838 , H01F17/00 , H01F17/04 , H01F27/2804 , H01F27/323 , H01F2027/2809 , H01L23/12 , H01L23/49822 , H02M3/00 , H02M3/04 , H05K1/16 , H05K3/46
Abstract: A coil built-in multilayer substrate includes a multilayer substrate, a coil, interlayer connection conductors, and gaps. The multilayer substrate includes a magnetic layer, a component-mounting land conductor provided on a first principal surface, and a terminal conductor provided on a second principal surface. The coil is provided in the magnetic layer and includes an axis extending in a direction perpendicular or substantially perpendicular to the first and second principal surfaces. The interlayer connection conductors are provided in the magnetic layer in a region inside the spiral coil. Gaps penetrate lateral surfaces of the interlayer connection conductors.
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公开(公告)号：US20180317324A1
公开(公告)日：2018-11-01
申请号：US16027404
申请日：2018-07-05
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Keito YONEMORI
Abstract: An electronic component module includes a substrate, a coil element provided in or on the substrate, and an IC element connected to the coil element, in which external terminals are provided on the substrate, the substrate includes a first region and a second region different region from the first region when the substrate is viewed in plan view, the IC element is provided in the first region, the external terminals are provided at least in the first region, the coil element extends across the first region and the second region, and the first region is a rigid region and the second region is more flexible than the first region.
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公开(公告)号：US20200187346A1
公开(公告)日：2020-06-11
申请号：US16793040
申请日：2020-02-18
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hirokazu YAZAKI , Keito YONEMORI
Abstract: An interposer includes an insulating element body, a wiring electrode inside the element body, a signal terminal electrode at the top surface of the element body and connected to a flat cable with a conductive bonding material interposed therebetween, and a ground terminal electrode. A through-hole penetrates through the element body to allow a bar-shaped metal fixing member to be inserted. A metal fixing member connecting electrode to be electrically connected to a metal fixing member is provided at at least one of the top surface of the element body and an inner wall of the through-hole. Predetermined signal terminal electrodes are electrically connected by the wiring electrode. The ground terminal electrode and the metal fixing member connecting electrode are electrically connected.
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公开(公告)号：US20190357345A1
公开(公告)日：2019-11-21
申请号：US16525692
申请日：2019-07-30
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hirokazu YAZAKI , Keito YONEMORI
Abstract: An interposer includes an insulating element body, a wiring electrode inside the element body, a signal terminal electrode at the top surface of the element body and connected to a flat cable with a conductive bonding material interposed therebetween, and a ground terminal electrode. A through-hole penetrates through the element body to allow a bar-shaped metal fixing member to be inserted. A metal fixing member connecting electrode to be electrically connected to a metal fixing member is provided at at least one of the top surface of the element body and an inner wall of the through-hole. Predetermined signal terminal electrodes are electrically connected by the wiring electrode. The ground terminal electrode and the metal fixing member connecting electrode are electrically connected.
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公开(公告)号：US20190341168A1
公开(公告)日：2019-11-07
申请号：US16513839
申请日：2019-07-17
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Keito YONEMORI , Hirokazu YAZAKI , Takanori TSUCHIYA
IPC: H01B7/08 , H05K1/02 , H01L23/495
Abstract: A circuit module includes an interposer, and the interposer includes an element body including a first surface, a first interposer terminal provided on the first surface of the element body, and connected to a first external element, a second interposer terminal provided on the first surface of the element body, and connected to a second external element, a first wiring provided in the element body, and electrically connecting the first interposer terminal and the circuit board with each other, a second wiring provided in the element body, and electrically connecting the second interposer terminal and the circuit board with each other, and a bypass wiring provided in the element body and/or on a surface of the element body, and electrically connecting the first interposer terminal and the second interposer terminal with each other.
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Patent Agency Ranking
公开(公告)号：US20190014655A1
公开(公告)日：2019-01-10
申请号：US16128571
申请日：2018-09-12
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hirokazu YAZAKI , Keito YONEMORI
IPC: H05K1/02 , H05K1/18 , H05K1/11 , H03H7/01 , H01F17/00 , H01F17/04 , H01G4/30 , H01G4/40 , H01F27/40
Abstract: A composite component-embedded circuit board includes a circuit board including a first functional block disposed closer to an upper surface of the circuit board, and a second functional block different from the first functional block and disposed closer to a lower surface of the circuit board, and a composite chip circuit embedded in the circuit board and including first and second circuit elements. The composite component further includes first and second terminal electrodes. The first terminal electrode is disposed on an upper surface of the composite component. The first terminal electrode is connected to the composite circuit and to the first functional block. The second terminal electrode is disposed on a lower surface of the composite component. The second terminal electrode is connected to the composite circuit and to the second functional block.
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公开(公告)号：US20220377893A1
公开(公告)日：2022-11-24
申请号：US17881703
申请日：2022-08-05
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Keito YONEMORI , Hirokazu YAZAKI , Takanori TSUCHIYA
Abstract: A circuit module includes an interposer, and the interposer includes an element body including a first surface, a first interposer terminal provided on the first surface of the element body, and connected to a first external element, a second interposer terminal provided on the first surface of the element body, and connected to a second external element, a first wiring provided in the element body, and electrically connecting the first interposer terminal and the circuit board with each other, a second wiring provided in the element body, and electrically connecting the second interposer terminal and the circuit board with each other, and a bypass wiring provided in the element body and/or on a surface of the element body, and electrically connecting the first interposer terminal and the second interposer terminal with each other.
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公开(公告)号：US20190297726A1
公开(公告)日：2019-09-26
申请号：US16438519
申请日：2019-06-12
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hirokazu YAZAKI , Keito YONEMORI , Takanori TSUCHIYA , Koji KAMADA , Takashi NOMA
Abstract: An interposer substrate includes a body, first to third external connection conductors, and a wiring conductor. The body includes first to third principal surfaces. A distance between the first and second principal surfaces is different from a distance between the first and third principal surfaces. The first external connection conductor is provided on the first principal surface and is connected to an external circuit board. The second external connection conductor is provided on the second principal surface and is connected to a first flat cable. The third external connection conductor is provided on the third principal surface and is connected to a second flat cable. The wiring conductor is provided in the body, and connects the first external connection conductor and second and third external connection conductors.
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公开(公告)号：US20190021166A1
公开(公告)日：2019-01-17
申请号：US16133736
申请日：2018-09-18
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Keito YONEMORI , Hirokazu YAZAKI
Abstract: A passive element array includes an element body that includes laminated base material layers, passive elements at different positions in the element body when viewed from a lamination direction of the base material layers, input/output terminals at a first main surface of the element body and connected to one end of each of the passive elements, input/output terminals at a second main surface of the element body and connected to the other end of each of the passive elements, a first ground terminal between the first input/output terminal and the input/output terminal at the first main surface, and a second ground terminal between the input/output terminal and the input/output terminal at the second main surface.
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公开(公告)号：US20190014665A1
公开(公告)日：2019-01-10
申请号：US16128573
申请日：2018-09-12
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hirokazu YAZAKI , Keito YONEMORI
Abstract: A passive element array includes an element body including laminated base material layers, first and second passive elements arranged in the element body perpendicular or substantially perpendicular to a lamination direction of the plurality of base material layers, a pair of first input/output terminals provided at one main surface of the element body and connected to the first passive element and a pair of second input/output terminals provided at the other main surface of the element body and connected to the second passive element.
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