公开(公告)号：US10021787B2

公开(公告)日：2018-07-10

申请号：US15373545

申请日：2016-12-09

申请人： Murata Manufacturing Co., Ltd.

发明人： Yoshihito Otsubo ,  Keisuke Araki ,  Yuki Ito ,  Kenji Kubota

IPC分类号： H05K1/00 ,  H05K1/14 ,  H05K1/02 ,  H05K1/03 ,  H05K1/18

CPC分类号： H05K1/147 ,  H05K1/0243 ,  H05K1/028 ,  H05K1/0281 ,  H05K1/0313 ,  H05K1/181 ,  H05K7/142

摘要： A resin substrate combined structure includes a first resin substrate including a flexible resin defining a main material and includes a first portion, a second resin substrate including a flexible resin defining a main material and includes a second portion spaced from the first portion in a thickness direction, and an insulating member that envelops the first portion and the second portion while retaining a relative positional relationship between the first portion and the second portion. The insulating member includes a material with a higher rigidity than any of the main material of the first resin substrate and that of the second resin substrate.