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1.发明授权公开(公告)号：US10103092B2
公开(公告)日：2018-10-16
申请号：US15673451
申请日：2017-08-10
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kuniaki Yosui , Keisuke Ikeno , Yuki Ito
Abstract: A multilayer substrate includes a flexible element assembly including a principal surface, a first to an n-th external electrode disposed on the principal surface, and at least one first dummy conductor disposed inside the element assembly and being in a floating state. When the element assembly is viewed from a normal direction that is normal to the principal surface, a distance between an m-th external electrode and a nearest external electrode therefrom among the first to the n-th external electrodes is defined as a distance Dm, an average of distances D1 to Dn is defined as an average Dave, and when the element assembly is viewed from the normal direction, an area within a circle with a center on the m-th external electrode and with a radius of Dm is defined as an area Am. The first dummy conductor is located in at least one area Am with a radius of Dm smaller than the average Dave when viewed from the normal direction.
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公开(公告)号：US10021787B2
公开(公告)日：2018-07-10
申请号：US15373545
申请日：2016-12-09
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Yoshihito Otsubo , Keisuke Araki , Yuki Ito , Kenji Kubota
CPC classification number: H05K1/147 , H05K1/0243 , H05K1/028 , H05K1/0281 , H05K1/0313 , H05K1/181 , H05K7/142
Abstract: A resin substrate combined structure includes a first resin substrate including a flexible resin defining a main material and includes a first portion, a second resin substrate including a flexible resin defining a main material and includes a second portion spaced from the first portion in a thickness direction, and an insulating member that envelops the first portion and the second portion while retaining a relative positional relationship between the first portion and the second portion. The insulating member includes a material with a higher rigidity than any of the main material of the first resin substrate and that of the second resin substrate.
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公开(公告)号：US09961780B2
公开(公告)日：2018-05-01
申请号：US14926316
申请日：2015-10-29
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hirofumi Shinagawa , Shigeru Tago , Masaki Kawata , Yuki Ito
CPC classification number: H05K3/32 , H01L2224/16225 , H01L2224/81 , H05K1/185 , H05K1/186 , H05K3/0073 , H05K3/306 , H05K3/4611 , H05K3/4632 , H05K3/4644 , H05K3/4697 , H05K2201/0129 , H05K2203/061 , H05K2203/063
Abstract: A method for manufacturing a resin multilayer board formed from a thermoplastic resin, which method allows for improvement in accuracy of the position of a component relative to the resin multilayer board, is provided. A method for manufacturing a resin multilayer board includes: a step of bonding a component to a pressure-sensitive adhesive layer of a pressure-sensitive adhesive sheet having the pressure-sensitive adhesive layer on a surface thereof; a step of opposing a thermoplastic resin sheet to the pressure-sensitive adhesive layer, and fixing the component bonded to the pressure-sensitive adhesive sheet and the thermoplastic resin sheet to each other by heating; a step of peeling the pressure-sensitive adhesive sheet from the component fixed to the thermoplastic resin sheet; and stacking and thermally welding a plurality of thermoplastic resin sheets including the thermoplastic resin sheet to which the component has been transferred.
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公开(公告)号：US09565346B2
公开(公告)日：2017-02-07
申请号：US14546048
申请日：2014-11-18
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Nobuo Ikemoto , Shigeru Tago , Yuki Ito
IPC: H04N5/225 , H04N5/335 , H01L31/0203 , G03B17/02
CPC classification number: H04N5/2253 , G03B17/02 , H04N5/2257
Abstract: A camera module includes an imaging function section, a connector forming section, and a connecting section combined in a laminated body. The connecting section is thinner than the imaging function section and is bendable. The imaging function section includes a cavity and a through hole. An image sensor IC is disposed within the cavity. A lens unit is mounted in the imaging function section to be optically coupled to the image sensor IC via the through hole. A light shielding member covers a boundary between the connecting section and the imaging function section that define a height difference.
Abstract translation: 相机模块包括成像功能部分，连接器形成部分和组合在层叠体中的连接部分。 连接部分比成像功能部分薄，可弯曲。 成像功能部分包括空腔和通孔。 图像传感器IC设置在腔内。 透镜单元安装在成像功能部分中，以通过通孔光学耦合到图像传感器IC。 遮光构件覆盖限定高度差的连接部和成像功能部之间的边界。
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公开(公告)号：US11923123B2
公开(公告)日：2024-03-05
申请号：US16166225
申请日：2018-10-22
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kazutaka Muraoka , Kuniaki Yosui , Yuki Ito , Naoki Gouchi
IPC: H01F27/28 , H01F17/00 , H01F41/04 , H05K1/16 , H05K3/18 , H05K3/46 , H01F27/29 , H05K1/02 , H05K1/11 , H05K3/00 , H05K3/24 , H05K3/40
CPC classification number: H01F27/2804 , H01F17/0013 , H01F41/041 , H01F41/043 , H05K1/165 , H05K3/188 , H05K3/4644 , H05K3/4661 , H01F2027/2809 , H01F27/29 , H01F27/292 , H05K1/0271 , H05K1/0296 , H05K1/115 , H05K3/0032 , H05K3/241 , H05K3/4038 , H05K2201/0154 , H05K2203/0723 , H05K2203/107
Abstract: A multilayer substrate includes first and second insulating layers stacked in a stacking direction with the second insulating layer located at a first side of the first insulating layer in the stacking direction, a first coil pattern disposed on a first principal surface of the first insulating layer on the first side of the first insulating layer in the stacking direction, and a second coil pattern disposed on a first principal surface of the second insulating layer on the first side of the second insulating layer in the stacking direction. The first and second coil patterns have spiral shapes. When viewed from the layer stacking direction, at least a portion of a first area in which the first coil pattern is disposed and at least a portion of a second area in which the second coil pattern is disposed overlap each other.
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Patent Agency Ranking
公开(公告)号：US11810703B2
公开(公告)日：2023-11-07
申请号：US16166227
申请日：2018-10-22
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Yuki Ito
IPC: H01F17/00 , H05K3/46 , H05K3/06 , H05K3/00 , H05K3/24 , H05K3/18 , H01F41/04 , H05K1/16 , H05K1/11 , H05K3/40
CPC classification number: H01F17/0013 , H01F41/041 , H05K1/165 , H05K3/00 , H05K3/0052 , H05K3/06 , H05K3/18 , H05K3/188 , H05K3/24 , H05K3/46 , H05K3/4661 , H01F2017/002 , H05K1/115 , H05K3/0023 , H05K3/0032 , H05K3/064 , H05K3/4069 , H05K2201/0129 , H05K2203/0723 , H05K2203/107
Abstract: A multilayer substrate includes an element assembly including a second insulating layer and a first insulating layer arranged in this order from a first side to a second side with respect to a layer stacking direction, a first conductor layer on the first side of the first insulating layer and including a plated layer, and a second conductor layer on the first side of the second insulating layer. The first conductor layer includes a first connection portion and a first circuit portion, and the second conductor layer includes a second connection portion and a second circuit portion. When viewed from the layer stacking direction, the first circuit portion includes an overlapping portion which overlaps the second circuit portion. A portion of the first connection portion connected to the second connection portion has a maximum thickness greater than a maximum thickness of the overlapping portion.
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公开(公告)号：US10455706B2
公开(公告)日：2019-10-22
申请号：US15928175
申请日：2018-03-22
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Shigeru Tago , Kuniaki Yosui , Yuki Ito
IPC: H05K5/00 , H05K3/32 , H05K3/46 , H05K1/11 , H05K3/00 , H05K1/02 , H05K7/00 , H05K1/18 , H05K3/40 , H05K3/34
Abstract: A resin substrate includes a thermoplastic resin base body, a mounting land conductor on a surface of the resin base body to be connected to a component, first and second reinforcement conductor patterns, and first interlayer connection conductors. The first and second reinforcement conductor patterns are each embedded in the resin base body and have a planar shape that includes a position overlapping the mounting land conductor when viewing the resin base body in plan view. The first interlayer connection conductors connect the first and second reinforcement conductor patterns in a thickness direction of the resin base body. The first interlayer connection conductors are arranged at positions different from the mounting land conductor when viewing the resin base body in plan view.
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公开(公告)号：US10098238B2
公开(公告)日：2018-10-09
申请号：US14886607
申请日：2015-10-19
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Masaki Kawata , Yuki Ito
Abstract: A method of manufacturing a resin multilayer substrate is provided in which a component (3) is incorporated in a stacked body obtained by stacking a plurality of thermoplastic resin sheets (2). The method includes the steps of: softening a first resin sheet (2a) by heating, and pressing the component (3) against the first resin sheet (2a), thereby fixing the component (3) to the first resin sheet (2a); stacking the first resin sheet (2a) on a second resin sheet (2b) having a through hole (14) receiving the component (3) and a third resin sheet (2c) located adjacent to a lower side of the component (3) such that the component (3) is inserted into the through hole (14) and the lower surface of the component (3) faces the third resin sheet (2c); and performing compression bonding by heating and pressurizing the stacked body including these resin sheets (2).
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公开(公告)号：US09974185B2
公开(公告)日：2018-05-15
申请号：US15015475
申请日：2016-02-04
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Shigeru Tago , Hirofumi Shinagawa , Yuki Wakabayashi , Kuniaki Yosui , Yuki Ito , Toshiro Adachi , Wataru Yanase , Masaki Kawata
CPC classification number: H05K1/185 , H05K1/0298 , H05K1/186 , H05K3/4682 , H05K2201/09072 , H05K2203/0278
Abstract: A component-embedded substrate includes a laminate and an electronic component. The electronic component is embedded in the laminate. The laminate includes a frame-shaped conductor pattern. When the laminate is viewed in a laminating direction, the frame-shaped conductor pattern is arranged so as to substantially surround the entire periphery of the electronic component. The frame-shaped conductor pattern includes a first individual conductor pattern and a second individual conductor pattern. The first individual conductor pattern and the second individual conductor pattern are separated from each other. The first individual conductor pattern is arranged close to a first external terminal electrode of the electronic component, and the second individual conductor pattern is arranged close to a second external terminal electrode of the electronic component.
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公开(公告)号：US10517170B2
公开(公告)日：2019-12-24
申请号：US16149162
申请日：2018-10-02
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Shinya Oguri , Yuki Ito , Yuya Dokai , Isamu Morita
Abstract: A multilayer board includes a flexible base material including laminated insulator layers and curved along an X-axis direction on a plane orthogonal or substantially orthogonal to a lamination direction, an interlayer connection conductor on the flexible base material, and a notch pair on the flexible base material at positions symmetrical or substantially symmetrical in the X-axis direction with respect to a position of the interlayer connection conductor, the notch pair extending in a Y-axis direction orthogonal or substantially orthogonal to the X-axis direction on the plane. The interlayer connection conductor is within a region defined by the notch pair and lines respectively joining ends of the notch pair in the Y-axis direction. A radius of curvature of a region of the flexible base material between the notch pair in the X-axis direction being greater than curvature radii of regions outside of the notch pair.
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