MULTILAYER SUBSTRATE AND ELECTRONIC DEVICE
    1.
    发明公开

    公开(公告)号:US20240055745A1

    公开(公告)日:2024-02-15

    申请号:US18223075

    申请日:2023-07-18

    Abstract: A multilayer substrate includes a multilayer body including resin layers stacked in a Z-axis direction, a signal conductor layer, and one or more through conductors passing through a first resin layer in the Z-axis direction. A first main surface of the first resin layer includes one or more hollow portions not in contact with the signal conductor layer and overlapping the signal conductor layer when viewed in the Z-axis direction. Each of the one or more hollow portions and the one or more through conductors includes a tapered region in which each of a cross-sectional area of the one or more hollow portions orthogonal to the Z-axis direction and a cross-sectional area of the one or more through conductors orthogonal to the Z-axis direction increases toward the first main surface. The tapered region is in contact with the first main surface of the first resin layer.

    TRANSMISSION LINE AND ELECTRONIC DEVICE
    2.
    发明公开

    公开(公告)号:US20230291086A1

    公开(公告)日:2023-09-14

    申请号:US18198473

    申请日:2023-05-17

    CPC classification number: H01P3/12 H01P3/082

    Abstract: In a transmission line, a hollow portion overlaps a first ground conductor layer in an up-down direction. In a first orthogonal direction, the hollow portion includes a first portion extending in a second orthogonal direction of a signal conductor layer. In the first portion, a portion at which a width of the first portion in the second orthogonal direction has a first portion maximum width value is a first portion maximum width portion. A portion at which the width of the first portion in the second orthogonal direction has a first portion minimum width value is a first portion minimum width portion. A portion at which the width of the first portion in the second orthogonal direction has a first portion intermediate width value is a first portion intermediate width portion located between the first portion maximum width portion and the first portion minimum width portion in the front-back direction.

    MULTILAYER RESIN SUBSTRATE AND METHOD OF MANUFACTURING MULTILAYER RESIN SUBSTRATE

    公开(公告)号:US20210410296A1

    公开(公告)日:2021-12-30

    申请号:US17471219

    申请日:2021-09-10

    Abstract: A multilayer resin substrate includes a stacked body including resin layers stacked on each other, a first planar conductor on a resin layer, and an interlayer connection conductor on a resin layer. The interlayer connection conductor includes a first interlayer connection conductor connected to an external conductor, and a second interlayer connection conductor bonded to the first interlayer connection conductor and a planar conductor. The first and second interlayer connection conductors are made of different materials. The second interlayer connection conductor includes a constricted portion including a smaller planar cross-sectional area than a different portion, between a bonding portion to which the first interlayer connection conductor is bonded and a bonding portion to which the planar conductor is bonded.

    ESD PROTECTION DEVICE
    4.
    发明申请
    ESD PROTECTION DEVICE 有权
    ESD保护装置

    公开(公告)号:US20150131193A1

    公开(公告)日:2015-05-14

    申请号:US14600137

    申请日:2015-01-20

    Inventor: Masanori OKAMOTO

    CPC classification number: H05F3/04 H01B1/02 H01B3/12 H01T1/20 H01T2/02 H01T4/12

    Abstract: An ESD protection device 1 includes a ceramic insulating material 10, first and second discharge electrodes 21 and 22, and a discharge auxiliary section 51. The discharge auxiliary section 51 is an electrode configured to reduce a discharge starting voltage between the first discharge electrode 21 and the second discharge electrode 22. The discharge auxiliary section 51 comprises a sintered body including conductive particles and at least one of semiconductor particles and insulating particles. At least the discharge auxiliary section 51 comprises at least one of an alkaline metal component and a boron component. The content of at least one of the alkaline metal component and the boron component in the discharge auxiliary section 51 is larger than the content of at least one of the alkaline metal component and the boron component in the ceramic insulating material 10.

    Abstract translation: ESD保护器件1包括陶瓷绝缘材料10,第一和第二放电电极21和22以及放电辅助部分51.放电辅助部分51是用于减小第一放电电极21和第二放电电极21之间的放电起始电压的电极 第二放电电极22.放电辅助部51包括包含导电粒子和半导体粒子和绝缘粒子中的至少一个的烧结体。 至少放电辅助部51包括碱金属成分和硼成分中的至少一种。 排出辅助部51中的碱金属成分和硼成分中的至少一种的含量比陶瓷绝缘材料10中的碱金属成分和硼成分中的至少一种的含量大。

    TRANSMISSION LINE AND ELECTRONIC DEVICE
    5.
    发明公开

    公开(公告)号:US20230290537A1

    公开(公告)日:2023-09-14

    申请号:US18198475

    申请日:2023-05-17

    CPC classification number: H01B7/0225 H01B3/30 H01B7/04

    Abstract: In a transmission line, a signal conductor layer extends in a front-back direction orthogonal to an up-down direction. A ground conductor layer is above the signal conductor layer. When viewed in a first orthogonal direction, first hollow portions are arranged in the front-back direction in a first direction of the signal conductor layer, and second hollow portions are arranged in the front-back direction in a second direction of the signal conductor layer. Each of regions between adjacent first hollow portions in the front-back direction is a first region. Each of regions between adjacent second hollow portions in the front-back direction is a second region. Each of the first hollow portions overlaps with a corresponding one of the second regions when viewed in a second orthogonal direction. Each of the second hollow portions overlaps with a corresponding one of the first regions when viewed in the second orthogonal direction.

Patent Agency Ranking