公开(公告)号：US20230198556A1

公开(公告)日：2023-06-22

申请号：US18168682

申请日：2023-02-14

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takanori UEJIMA ,  Hiromichi KITAJIMA ,  Naoya MATSUMOTO ,  Hisanori MURASE ,  Nanami YUMURA ,  Yoichi SAWADA

IPC: H04B1/03 ,  H04B1/18 ,  H04B1/04

CPC classification number: H04B1/03 ,  H04B1/18 ,  H04B1/04 ,  H04B2001/0408

Abstract: A radio-frequency module includes: a module substrate having a major face; a first circuit component and a second circuit component that are disposed over the major face; a resin component that covers the first circuit component and the second circuit component; a metal shield layer that covers a surface of the resin component; a metal shield plate that is disposed over the major face and, with the module substrate seen in plan view, located between the first circuit component and the second circuit component; and a via-conductor disposed in the module substrate and set to a ground potential. The metal shield plate is in contact with the metal shield layer, and connected at the major face with the via-conductor. The metal shield plate has a thickness greater than a thickness of the metal shield layer and less than or equal to an outside diameter (of the via-conductor.

公开(公告)号：US20240421845A1

公开(公告)日：2024-12-19

申请号：US18740692

申请日：2024-06-12

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Shogo YANASE ,  Nanami YUMURA ,  Masaki TADA ,  Yuusuke KISHI ,  Ryoya SHIOMI ,  Takanori UEJIMA ,  Naru MORITO ,  Masaki KIMURA ,  Hiroyuki NAGAMORI ,  Mizuki KINOSHITA ,  Minoru IWANAGA ,  Takuma KUROYANAGI

IPC: H04B1/40 ,  H01Q1/22 ,  H03H9/64 ,  H03H9/72

Abstract: A radio frequency module includes a substrate having a mounting surface, components for transmission and a component for transmission and reception that are disposed on the mounting surface, acoustic wave filters disposed between each of the components for transmission and the component for transmission and reception, and shield electrodes each formed on a corresponding one of side surfaces of the acoustic wave filters.

公开(公告)号：US20230155611A1

公开(公告)日：2023-05-18

申请号：US18157265

申请日：2023-01-20

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Masakazu HIROBE ,  Takanori UEJIMA ,  Yoshihiro DAIMON ,  Nanami YUMURA

IPC: H04B1/00 ,  H04B1/16

CPC classification number: H04B1/0078 ,  H04B1/1615

Abstract: A radio frequency module includes a transmit filter that allows a transmit signal of a band A for FDD to pass through, a receive filter that allows a receive signal of the band A to pass through, a filter that allows a transmit/receive signal of a band B for TDD to pass through, power amplifiers, a low noise amplifier, a switch between connecting the receive filter to the low noise amplifier and connecting the filter to the low noise amplifier, a switch between connecting the filter to the power amplifier and connecting the filter to the low noise amplifier, a matching circuit connected between the power amplifier and the transmit filter, a matching circuit connected between the power amplifier and the switch, and a module board. On the module board, each of the power amplifiers and the switch is arranged in between the matching circuit and the matching circuit.