公开(公告)号：US20240239080A1

公开(公告)日：2024-07-18

申请号：US18623486

申请日：2024-04-01

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yusuke ARAKAWA ,  Ryotaro NAMBA

IPC: B32B3/26 ,  B32B15/04 ,  B32B15/08 ,  B32B27/28 ,  B32B38/00

CPC classification number: B32B3/263 ,  B32B15/043 ,  B32B15/08 ,  B32B27/28 ,  B32B38/0036 ,  B32B2250/03 ,  B32B2311/12 ,  B32B2311/22

Abstract: A laminated structure that includes: a resin substrate; a barrier film on the resin substrate and containing a first metal element; and a metal layer on the barrier film and containing a second metal element, where a part of the metal layer penetrates the barrier film and extends to an inside of the resin substrate.