公开(公告)号：US20240239080A1

公开(公告)日：2024-07-18

申请号：US18623486

申请日：2024-04-01

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yusuke ARAKAWA ,  Ryotaro NAMBA

IPC: B32B3/26 ,  B32B15/04 ,  B32B15/08 ,  B32B27/28 ,  B32B38/00

CPC classification number: B32B3/263 ,  B32B15/043 ,  B32B15/08 ,  B32B27/28 ,  B32B38/0036 ,  B32B2250/03 ,  B32B2311/12 ,  B32B2311/22

Abstract: A laminated structure that includes: a resin substrate; a barrier film on the resin substrate and containing a first metal element; and a metal layer on the barrier film and containing a second metal element, where a part of the metal layer penetrates the barrier film and extends to an inside of the resin substrate.

公开(公告)号：US20200152387A1

公开(公告)日：2020-05-14

申请号：US16678074

申请日：2019-11-08

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Syunsuke TAKEUCHI ,  Yusuke ARAKAWA ,  Masaki TSUTSUMI

IPC: H01G4/232 ,  H01G4/248 ,  H01G4/30

Abstract: A ceramic electronic component includes a ceramic body having first and second end surfaces facing each other, first and second side surfaces facing each other, first and second principal surfaces facing each other, and also includes outer electrodes each of which is provided on at least one portion of a corresponding one of the first and second end surfaces of the ceramic body. Each of the outer electrodes includes an underlying electrode layer provided on at least one portion of a corresponding one of the first and second end surfaces of the ceramic body and also includes a plating layer provided on a corresponding one of the underlying electrode layers and on a corresponding one of regions different from the underlying electrode layers.