公开(公告)号：US20150194943A1

公开(公告)日：2015-07-09

申请号：US14661181

申请日：2015-03-18

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kanta MOTOKI ,  Sayyed TABIB ,  Saneaki ARIUMI

IPC: H03H7/01

CPC classification number: H03H7/0138 ,  H01G4/40 ,  H03H7/0115 ,  H03H2001/0085 ,  H05K1/0233 ,  H05K1/162 ,  H05K1/165 ,  H05K1/181 ,  H05K3/403 ,  H05K2201/083

Abstract: A built-in-circuit substrate includes a substrate body, an electrical circuit including inner electrodes provided inside the substrate body and to which an RF signal is input, outer electrodes which are provided on the substrate body so as to be connected to the electrical circuit and which each include an underlying metal layer and a nickel layer covering at least a portion of the underlying metal layer, and a permanent magnet which is arranged on the substrate body. Thus, noise caused by intermodulation distortion generated in the nickel layers of the outer electrodes is prevented.

Abstract translation: 内置电路基板包括基板主体，电路，包括设置在基板本体内并且输入RF信号的内部电极，设置在基板主体上以连接到电路的外部电极 并且其各自包括底层金属层和覆盖下面的金属层的至少一部分的镍层和布置在基底主体上的永磁体。 因此，防止在外部电极的镍层中产生的互调失真引起的噪声。