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公开(公告)号：US20210092852A1
公开(公告)日：2021-03-25
申请号：US17115003
申请日：2020-12-08
发明人： Saneaki ARIUMI
IPC分类号： H05K3/46 , H01Q1/38 , H01Q9/04 , H01Q13/08 , H01Q21/06 , H01Q23/00 , H05K1/02 , H05K1/16 , H05K3/40
摘要： A multilayer substrate includes a plurality of insulator layers laminated, a column conductor extending through two or more insulator layers among the plurality of insulator layers. The column conductor includes a first via conductor extending through a first insulator layer and a second via conductor extending through a second insulator layer adjacent to the first insulator layer. Each of the first via conductor and the second via conductor has a tapered shape in which a cross section decreases from one end portion to the other end portion in the lamination direction of the plurality of insulator layers. The first via conductor and the second via conductor are directly bonded to each other at large diameter portions that are end portions with a large cross section or small diameter portions that are end portions with a small cross section.
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公开(公告)号：US20190173167A1
公开(公告)日：2019-06-06
申请号：US16266419
申请日：2019-02-04
发明人： Saneaki ARIUMI
摘要： The present disclosure improves, in an antenna module, the isolation characteristic between an output signal from an antenna and an input signal. An antenna module includes a dielectric substrate having a first surface and a second surface, an antenna formed on the first surface, a radio frequency element configured to supply a radio frequency signal to the antenna, and a signal terminal formed into a columnar shape using a conductive material. The signal terminal is connected to the radio frequency element by a wiring pattern in the dielectric substrate. The signal terminal is disposed outside an excitation region generated in an excitation direction of an output signal.
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公开(公告)号：US20220029273A1
公开(公告)日：2022-01-27
申请号：US17496811
申请日：2021-10-08
发明人： Saneaki ARIUMI
摘要： A module component includes a substrate having a first principal surface, a semiconductor substrate disposed on the first principal surface of the substrate, multiple terminals, and a resin layer. The terminals include multiple reference-potential terminals, which are electrically connected to the reference potential, and multiple signal terminals, which are disposed adjacent to at least one of the reference-potential terminals in the direction along an end portion of the substrate and which are supplied with a signal. In a plan view in the direction perpendicular to the first principal surface of the substrate, in at least one of the reference-potential terminals, the support portion is disposed between an end surface of the connection portion and the end portion of the substrate, and, in at least one of the signal terminals, the end surface of the connection portion is disposed between the support portion and the end portion of the substrate.
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公开(公告)号：US20200344896A1
公开(公告)日：2020-10-29
申请号：US16908827
申请日：2020-06-23
发明人： Saneaki ARIUMI , Tomoshige FURUHI , Sho SUZUKI
摘要： The insertion loss of a multilayer substrate and an antenna element is reduced. A multilayer substrate according to an embodiment of the present disclosure includes a multilayer body, a wire conductor, and a first ground electrode. The multilayer body is formed by dielectric layers being layered. The wire conductor is formed in the multilayer body, and a radio frequency signal passes through the wire conductor. The first ground electrode is formed in or on the multilayer body and includes a first surface that faces the wire conductor. The first surface includes a first region and a second region. The surface roughness of the first region is lower than the surface roughness of the second region. The first region overlaps at least part of the wire conductor in plan view in a direction normal to the first ground electrode.
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公开(公告)号：US20150194943A1
公开(公告)日：2015-07-09
申请号：US14661181
申请日：2015-03-18
发明人： Kanta MOTOKI , Sayyed TABIB , Saneaki ARIUMI
IPC分类号： H03H7/01
CPC分类号： H03H7/0138 , H01G4/40 , H03H7/0115 , H03H2001/0085 , H05K1/0233 , H05K1/162 , H05K1/165 , H05K1/181 , H05K3/403 , H05K2201/083
摘要： A built-in-circuit substrate includes a substrate body, an electrical circuit including inner electrodes provided inside the substrate body and to which an RF signal is input, outer electrodes which are provided on the substrate body so as to be connected to the electrical circuit and which each include an underlying metal layer and a nickel layer covering at least a portion of the underlying metal layer, and a permanent magnet which is arranged on the substrate body. Thus, noise caused by intermodulation distortion generated in the nickel layers of the outer electrodes is prevented.
摘要翻译： 内置电路基板包括基板主体，电路，包括设置在基板本体内并且输入RF信号的内部电极，设置在基板主体上以连接到电路的外部电极 并且其各自包括底层金属层和覆盖下面的金属层的至少一部分的镍层和布置在基底主体上的永磁体。 因此，防止在外部电极的镍层中产生的互调失真引起的噪声。
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公开(公告)号：US20210184344A1
公开(公告)日：2021-06-17
申请号：US17189442
申请日：2021-03-02
摘要： An antenna module (100) includes a dielectric substrate (160) having a multilayer structure, a first radiation electrode (122), a second radiation electrode (121), and a ground electrode (GND). The second radiation electrode (121) is arranged between the first radiation electrode (122) and the ground electrode (GND) in a lamination direction of the dielectric substrate (160). In the dielectric substrate (160), a hollow portion (150) is disposed in at least a portion between the first radiation electrode (122) and the second radiation electrode (121).
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公开(公告)号：US20200036103A1
公开(公告)日：2020-01-30
申请号：US16592989
申请日：2019-10-04
发明人： Saneaki ARIUMI
摘要： An antenna module (10) includes a dielectric substrate (110), patch antennas (100) that are disposed at locations near a first main surface of the dielectric substrate (110), a RFIC (30) that is mounted at a location near a second main surface of the dielectric substrate (110) opposite the first main surface and that is electrically connected to the patch antennas (100), and an identification mark (50) that is located in an antenna arrangement area that is an area of the dielectric substrate (110) except for an outer circumferential area in which the patch antennas (100) are not arranged. The identification mark (50) is located in the antenna arrangement area so as not to overlap feed points (115) with which the respective patch antennas (100) are provided in a plan view of the first main surface.
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公开(公告)号：US20160352365A1
公开(公告)日：2016-12-01
申请号：US15235267
申请日：2016-08-12
IPC分类号： H04B1/00
CPC分类号： H04B1/0057 , H04B1/0458 , H04B1/52
摘要： A high-frequency front end circuit includes a duplexer, a phase adjustment circuit, and a power amplifier. The phase adjustment circuit is connected between the power amplifier and a transmission filter of the duplexer. The phase adjustment circuit carries out phase adjustment so that a quadrant in which an impedance ZRX (fr0) seen from the transmission filter toward the power amplifier at the fundamental frequency of a reception signal is present and a quadrant in which an impedance ZTX (fr0) seen from the power amplifier toward the transmission filter at the fundamental frequency of the reception signal is present are not in a conjugate relationship with respect to the phase.
摘要翻译： 高频前端电路包括双工器，相位调整电路和功率放大器。 相位调整电路连接在功率放大器和双工器的发送滤波器之间。 相位调整电路进行相位调整，使得存在从发送滤波器向接收信号的基频看到的功率放大器的阻抗ZRX（fr0）的象限和存在阻抗ZTX（fr0）的象限， 从功率放大器向接收信号的基频处的发送滤波器看到的相对于相位不是共轭关系。
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公开(公告)号：US20210250079A1
公开(公告)日：2021-08-12
申请号：US17243820
申请日：2021-04-29
发明人： Saneaki ARIUMI
摘要： A support has a first surface and a second surface, and directions of normal vectors of the first surface and the second surface pointing outside are different from each other. A first antenna is provided on the first surface, and a second antenna is provided on a second surface. A radio frequency signal received at the first antenna is transmitted through a transmission line to the second antenna, and a radio frequency signal received at the second antenna is transmitted through the transmission line to the first antenna. The first antenna, the second antenna, and the transmission line are configured such that the directivity of the first antenna is different from the directivity of the second antenna.
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公开(公告)号：US20200337157A1
公开(公告)日：2020-10-22
申请号：US16799996
申请日：2020-02-25
发明人： Saneaki ARIUMI
IPC分类号： H05K3/46 , H01Q13/08 , H01Q21/06 , H01Q9/04 , H01Q23/00 , H01Q1/38 , H05K1/02 , H05K1/16 , H05K3/40
摘要： A multilayer substrate includes a plurality of insulator layers laminated, a column conductor extending through two or more insulator layers among the plurality of insulator layers. The column conductor includes a first via conductor extending through a first insulator layer and a second via conductor extending through a second insulator layer adjacent to the first insulator layer. Each of the first via conductor and the second via conductor has a tapered shape in which a cross section decreases from one end portion to the other end portion in the lamination direction of the plurality of insulator layers. The first via conductor and the second via conductor are directly bonded to each other at large diameter portions that are end portions with a large cross section or small diameter portions that are end portions with a small cross section.
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