公开(公告)号：US20200152386A1

公开(公告)日：2020-05-14

申请号：US16679410

申请日：2019-11-11

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kenichi TOGOU ,  Shinsuke UCHIDA

IPC: H01G4/232 ,  H01G4/012 ,  H01G4/33 ,  H01G4/12 ,  H01G4/224 ,  H01G13/00

Abstract: A multilayer ceramic capacitor includes a laminated body including a plurality of dielectric layers and a plurality of internal electrodes that are alternately laminated, and a first external electrode and a second external electrode provided on the surface of the laminated body. The first external electrode is provided on a first end surface of the laminated body, and extends from the first end surface of the laminated body to form a portion of the first side surface and a portion of the second side surface. The plurality of internal electrodes includes a first internal electrode and a second internal electrode. The first internal electrode is exposed at the first side surface and the second side surface of the laminated body and electrically connected to the first external electrode, and is not exposed at the first end surface of the laminated body.

公开(公告)号：US20170040112A1

公开(公告)日：2017-02-09

申请号：US15229282

申请日：2016-08-05

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Junya TANAKA ,  Shinsuke UCHIDA

IPC: H01G4/30 ,  H01G4/012 ,  H01G4/248 ,  H01G4/12

Abstract: A method of manufacturing a ceramic electronic component including a main body including a first principal surface and a second principal surface opposite to each other, and a first external electrode and a second external electrode provided on a portion of a surface of the main body, includes providing a plurality of recesses in a first principal surface of a laminated block including a ceramic material and an organic substance by relatively moving the laminated block and a protrusion surface including a protrusion, in a direction along the first principal surface of the laminated block with the protrusion surface being in contact with a first principal surface of the laminated block, obtaining a chip by cutting the laminated block including the recesses, and obtaining the main body by firing the chip.

Abstract translation: 一种陶瓷电子部件的制造方法，其特征在于，包括具有彼此相对的第一主面和第二主面的主体以及设置在所述主体的表面的一部分上的第一外部电极和第二外部电极， 在包括陶瓷材料和有机物质的叠层块的第一主表面中通过相对移动层叠块和包括突起的突起表面在沿着层叠块的第一主表面的方向上提供多个凹槽，其中 突起表面与层压块的第一主表面接触，通过切割包括凹部的层叠块获得芯片，并且通过烧结芯片获得主体。