公开(公告)号：US20170040112A1

公开(公告)日：2017-02-09

申请号：US15229282

申请日：2016-08-05

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Junya TANAKA ,  Shinsuke UCHIDA

IPC: H01G4/30 ,  H01G4/012 ,  H01G4/248 ,  H01G4/12

Abstract: A method of manufacturing a ceramic electronic component including a main body including a first principal surface and a second principal surface opposite to each other, and a first external electrode and a second external electrode provided on a portion of a surface of the main body, includes providing a plurality of recesses in a first principal surface of a laminated block including a ceramic material and an organic substance by relatively moving the laminated block and a protrusion surface including a protrusion, in a direction along the first principal surface of the laminated block with the protrusion surface being in contact with a first principal surface of the laminated block, obtaining a chip by cutting the laminated block including the recesses, and obtaining the main body by firing the chip.

Abstract translation: 一种陶瓷电子部件的制造方法，其特征在于，包括具有彼此相对的第一主面和第二主面的主体以及设置在所述主体的表面的一部分上的第一外部电极和第二外部电极， 在包括陶瓷材料和有机物质的叠层块的第一主表面中通过相对移动层叠块和包括突起的突起表面在沿着层叠块的第一主表面的方向上提供多个凹槽，其中 突起表面与层压块的第一主表面接触，通过切割包括凹部的层叠块获得芯片，并且通过烧结芯片获得主体。

公开(公告)号：US20150083315A1

公开(公告)日：2015-03-26

申请号：US14490208

申请日：2014-09-18

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Junya TANAKA

IPC: H01G4/30 ,  B32B37/18 ,  B32B38/00 ,  B32B38/18

CPC classification number: H01G4/30 ,  B26D7/32 ,  B32B37/18 ,  B32B38/0004 ,  B32B38/10 ,  B32B38/18 ,  B32B38/1808 ,  B65G47/28 ,  H01G4/232 ,  H01G13/00 ,  H01G13/006 ,  Y10T156/1075 ,  Y10T156/13

Abstract: A method for manufacturing a capacitor element includes singulating a mother block into a plurality of laminate blocks having a shape of an elongated, substantially rectangular parallelepiped, by dividing the mother block in rows; rolling each of the plurality of laminate blocks; and singulating each of the plurality of laminate blocks into a plurality of laminate chips having a shape of a substantially rectangular parallelepiped, by dividing the plurality of laminate blocks after rolling in columns. The step of rolling each of the plurality of laminate blocks includes the step of moving the plurality of laminate blocks placed on a stage, along a direction in which the plurality of laminate blocks are arranged side by side, thereby sequentially pushing each of the plurality of laminate blocks to an end portion of the stage and causing each of the plurality of laminate blocks to rotationally fall from the end portion.

Abstract translation: 制造电容器元件的方法包括：通过将母块分成几行，将母块分割为具有细长的，基本上长方体的形状的多个叠层块; 滚动多个层压块中的每一个; 并且通过在列中轧制之后分割多个层压块，将多个层压块中的每一个分成多个具有基本上长方体形状的层压片。 滚动多个层叠块中的每一个的步骤包括沿着多个层叠块并排布置的方向移动放置在台架上的多个层叠块的步骤，从而顺序地将多个 层叠块到阶段的端部，并且使得多个层压块中的每一个从端部旋转地落下。

公开(公告)号：US20130199717A1

公开(公告)日：2013-08-08

申请号：US13759177

申请日：2013-02-05

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Junya TANAKA ,  Hironori TSUTSUMI

IPC: B32B38/00

CPC classification number: B32B38/0004 ,  B26D1/147 ,  B26D1/15 ,  B32B2315/02 ,  C04B2237/32 ,  C04B2237/40 ,  H01G4/0085 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30 ,  Y10T156/1052 ,  Y10T156/1075 ,  Y10T156/1348

Abstract: A ceramic green sheet laminate is produced by stacking ceramic green sheets, each including conductive films for forming first or second internal electrodes on a surface thereof. A first cutting step is performed in which the ceramic green sheet laminate is cut to form first and second end surfaces at which the first or second internal electrodes are exposed. A second cutting step is performed in which the ceramic green sheet laminate is cut to form first and second side surfaces at which the first and second internal electrodes are exposed. In the second cutting step, the ceramic green sheet laminate is pressed and cut by moving a cutting blade in a length direction or a width direction.

Abstract translation: 通过层叠陶瓷生片来形成陶瓷生片层压体，每个陶瓷生片包括用于在其表面上形成第一或第二内部电极的导电膜。 进行第一切割步骤，其中切割陶瓷生片层压体以形成暴露第一或第二内部电极的第一和第二端面。 进行第二切割步骤，其中切割陶瓷生片层压体以形成暴露第一和第二内部电极的第一和第二侧表面。 在第二切割工序中，通过在长度方向或宽度方向上移动切割刀片来压制和切割陶瓷生片层叠体。

公开(公告)号：US20130208398A1

公开(公告)日：2013-08-15

申请号：US13764829

申请日：2013-02-12

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Junya TANAKA ,  Daisuke HAMADA

IPC: H01G4/30

CPC classification number: H01G4/306 ,  H01G4/012 ,  H01G4/12 ,  H01G4/30 ,  Y10T29/43

Abstract: A rectangular or substantially rectangular parallelepiped chip including first and second end surfaces and first and second side surfaces is produced by cutting a mother block along a first direction in a portion where, of conductive layers that are adjacent to each other in a stacking direction, a first one is present and a second one is not present and cutting of the mother block along a second direction in a portion where, of the conductive layers that are adjacent to each other in the stacking direction, the second one is present and the first one is not present. A first internal electrode formed from the first conductive layer is exposed at the first end and side surfaces and not exposed at either of the second end and side surfaces. A second internal electrode formed from the second conductive layer is exposed at the second end and side surfaces and not exposed at either of the first end and side surfaces.

Abstract translation: 包括第一和第二端面以及第一和第二侧表面的矩形或大致长方体的芯片通过沿着第一方向切割母块而产生，所述第一和第二端面在层叠方向上彼此相邻的导电层， 第一个存在，第二个不存在，并且沿着第二方向切割母块，其中在层叠方向上彼此相邻的导电层中存在第二个的导电层，第一个 不存在 由第一导电层形成的第一内部电极在第一端和侧表面露出，而不暴露在第二端和侧表面中的任何一个处。 由第二导电层形成的第二内部电极在第二端和侧表面处露出，而不暴露在第一端和侧表面中的任一个处。