VAPOR CHAMBER, HEATSINK DEVICE, AND ELECTRONIC DEVICE

    公开(公告)号:US20210136955A1

    公开(公告)日:2021-05-06

    申请号:US16670204

    申请日:2019-10-31

    IPC分类号: H05K7/20 F28D15/04

    摘要: A vapor chamber that includes a housing including a first sheet and a second sheet opposing each other and joined together at outer edges of the first sheet and the second sheet and defining a hollow vapor flow pass therein; a working fluid in the housing; a first wick in contact with the vapor flow pass; and a second wick between the first wick and an inner wall surface of at least one of the first sheet and the second sheet. The first wick defines a first liquid flow pass, the second wick defines a second liquid flow pass, and a first average diameter of the first liquid flow pass is smaller than or equal to 75% of a second average diameter of the second liquid flow pass.

    VAPOR CHAMBER
    3.
    发明申请
    VAPOR CHAMBER 审中-公开

    公开(公告)号:US20200049421A1

    公开(公告)日:2020-02-13

    申请号:US16655349

    申请日:2019-10-17

    IPC分类号: F28D15/04 H05K7/20

    摘要: A vapor chamber that includes a housing; a pillar arranged in the housing; a working fluid sealed in the housing; and a wick arranged in the housing. The pillar has a first bottom surface and a second bottom surface, and pores therein. The first bottom surface is in contact with a first main interior surface of the housing and the second bottom surface is in contact with the wick. The first bottom surface has an area larger than an area of the second bottom surface. The pillar has a side surface connecting a periphery of the first bottom surface and a periphery of the second bottom surface. A cross-sectional area of the pillar decreases along a direction from the first bottom surface to the second bottom surface.