Multilayer electronic component and multilayer electronic component manufacturing method
    2.
    发明授权
    Multilayer electronic component and multilayer electronic component manufacturing method 有权
    多层电子元器件及多层电子元器件制造方法

    公开(公告)号:US08754724B2

    公开(公告)日:2014-06-17

    申请号:US13690036

    申请日:2012-11-30

    Abstract: A multilayer electronic component and a multilayer electronic component manufacturing method are capable of easily controlling the degree of magnetic field coupling between inductors. Via-hole conductors are arranged so that they extend in a lamination direction in a laminate, and function as a first inductor. Via-hole conductors are arranged so that they extend in the lamination direction in the laminate, and function as a second inductor. A first capacitor and the first inductor define a first resonance circuit. A second capacitor and the second inductor define a second resonance circuit. The via-hole conductors are arranged in a first insulating layer so that they are spaced apart from each other by a first distance. The via-hole conductors are arranged in a second insulating layer so that they are spaced apart from each other by a second distance that is different from the first distance.

    Abstract translation: 多层电子部件和多层电子部件制造方法能够容易地控制电感器之间的磁场耦合度。 通孔导体被布置为使得它们在层压体中沿层叠方向延伸,并且用作第一电感器。 通孔导体被布置成使得它们在层叠体中沿层叠方向延伸,并且用作第二电感器。 第一电容器和第一电感器限定第一谐振电路。 第二电容器和第二电感器限定第二谐振电路。 通孔导体布置在第一绝缘层中,使得它们彼此间隔开第一距离。 通孔导体布置在第二绝缘层中,使得它们彼此间隔开与第一距离不同的第二距离。

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