公开(公告)号：US20240194579A1

公开(公告)日：2024-06-13

申请号：US18444982

申请日：2024-02-19

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshifumi SAITO ,  Yoshinori KIN ,  Tomoki YAMAMOTO ,  Yoshiki TOBITA

IPC: H01L23/498 ,  H01L23/15 ,  H01L23/31 ,  H01L25/16

CPC classification number: H01L23/49838 ,  H01L23/15 ,  H01L23/3135 ,  H01L23/3142 ,  H01L23/49811 ,  H01L25/16

Abstract: An electronic component module with components mounted on both surfaces of a board, the electronic component module including: a circuit board including a first main surface and a second main surface; a first electronic component mounted on the first main surface; a second electronic component mounted on the second main surface; an electrode for input/output on the first main surface; a columnar electrode connected to the electrode for input/output; a sealing resin layer covering the first main surface; an insulating layer covering the first electronic component and the sealing resin layer; an input/output electrode on the insulating layer; and a conductor, wherein the columnar electrode 154 includes an end surface exposed from the sealing resin layer, and the input/output electrode is connected to the columnar electrode through the conductor.