公开(公告)号：US20230371182A1

公开(公告)日：2023-11-16

申请号：US18359074

申请日：2023-07-26

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshiki TOBITA ,  Issei YAMAMOTO

IPC: H05K1/16 ,  H01L23/498 ,  H05K1/18 ,  H01F27/28 ,  H05K1/11

CPC classification number: H05K1/165 ,  H01L23/49838 ,  H05K1/181 ,  H01F27/2804 ,  H05K1/111 ,  H05K2201/10166 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/10234 ,  H05K2201/10522 ,  H01L24/16

Abstract: To provide wiring board capable of reducing influence of variation in size of conductive member on coil conductor. Wiring board according to present disclosure includes insulating layer, plurality of land electrodes formed on lower surface of insulating layer, solder ball formed on surface of at least one of plurality of land electrodes, and coil conductor provided inside insulating layer and having winding axis intersecting lower surface. Plurality of land electrodes includes electrode at a position overlapped opening of coil conductor in plan view seen at the wiring board from lower surface side, and second electrode at a position deviated from opening of coil conductor in plan view. Area of first electrode is larger than area of second electrode in plan view.

公开(公告)号：US20240194579A1

公开(公告)日：2024-06-13

申请号：US18444982

申请日：2024-02-19

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshifumi SAITO ,  Yoshinori KIN ,  Tomoki YAMAMOTO ,  Yoshiki TOBITA

IPC: H01L23/498 ,  H01L23/15 ,  H01L23/31 ,  H01L25/16

CPC classification number: H01L23/49838 ,  H01L23/15 ,  H01L23/3135 ,  H01L23/3142 ,  H01L23/49811 ,  H01L25/16

Abstract: An electronic component module with components mounted on both surfaces of a board, the electronic component module including: a circuit board including a first main surface and a second main surface; a first electronic component mounted on the first main surface; a second electronic component mounted on the second main surface; an electrode for input/output on the first main surface; a columnar electrode connected to the electrode for input/output; a sealing resin layer covering the first main surface; an insulating layer covering the first electronic component and the sealing resin layer; an input/output electrode on the insulating layer; and a conductor, wherein the columnar electrode 154 includes an end surface exposed from the sealing resin layer, and the input/output electrode is connected to the columnar electrode through the conductor.

公开(公告)号：US20230371183A1

公开(公告)日：2023-11-16

申请号：US18359227

申请日：2023-07-26

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshiki TOBITA ,  Issei YAMAMOTO

IPC: H05K1/16 ,  H05K1/11

CPC classification number: H05K1/165 ,  H05K1/115

Abstract: A wiring board includes at least one insulating layer, plurality of conductive members, at least one land electrode formed at position overlapping first surface in plan view of insulating layer as viewed from first surface side, land electrode being connected to each of at least one conductive member, and coil conductor provided inside insulating layer or on second surface on back side of first surface in insulating layer and having winding axis intersecting first surface. Plurality of conductive members includes first conductive member at position where at least part of the first conductive member overlaps opening of the coil conductor in plan view seen from first surface side, and second conductive member at position deviated from opening of coil conductor in plan view seen from first surface side. Area of first conductive member is smaller than area of second conductive member in plan view seen from first surface side.