公开(公告)号：US20240040694A1

公开(公告)日：2024-02-01

申请号：US18485650

申请日：2023-10-12

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Tomoki YAMAMOTO ,  Tatsunori KAN

IPC: H05K1/03 ,  H05K1/11 ,  C03C14/00 ,  C03C4/16

CPC classification number: H05K1/0306 ,  H05K1/115 ,  C03C14/004 ,  C03C4/16 ,  H05K2201/0175 ,  H05K2201/0209 ,  C03C2214/04 ,  C03C2214/20 ,  C03C2204/00

Abstract: A wiring board that includes: a wiring conductor; a first dielectric layer around the wiring conductor and containing a first glass and a first ceramic filler; and a second dielectric layer interposed between the wiring conductor and the first dielectric layer, the second dielectric layer being in contact with the wiring conductor and the first dielectric layer, and the second dielectric layer containing a second glass and a second ceramic filler. A sintering temperature of the second glass contained in the second dielectric layer is higher than a sintering temperature of the wiring conductor, and a grain size of the second glass contained in the second dielectric layer is smaller than a grain size of the first glass contained in the first dielectric layer.

公开(公告)号：US20250087568A1

公开(公告)日：2025-03-13

申请号：US18960244

申请日：2024-11-26

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Issei YAMAMOTO ,  Tomoki YAMAMOTO

IPC: H01L23/498

Abstract: A multilayer substrate that includes: a first thermoplastic resin layer including a first main surface, a second main surface opposite to the first main surface, and a via hole penetrating from the first main surface to the second main surface; a ceramic layer in contact with the first main surface; a second thermoplastic resin layer in contact with the second main surface; a first electrode on a surface of the ceramic layer in contact with the first main surface; a protective layer covering at least part of an outline of the first electrode; a second electrode on a surface of the second thermoplastic resin layer in contact with the second main surface; an interlayer connection conductor in the via hole and connecting the first electrode and the second electrode; and an intermetallic compound between the interlayer connection conductor and the first electrode.

公开(公告)号：US20240194579A1

公开(公告)日：2024-06-13

申请号：US18444982

申请日：2024-02-19

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshifumi SAITO ,  Yoshinori KIN ,  Tomoki YAMAMOTO ,  Yoshiki TOBITA

IPC: H01L23/498 ,  H01L23/15 ,  H01L23/31 ,  H01L25/16

CPC classification number: H01L23/49838 ,  H01L23/15 ,  H01L23/3135 ,  H01L23/3142 ,  H01L23/49811 ,  H01L25/16

Abstract: An electronic component module with components mounted on both surfaces of a board, the electronic component module including: a circuit board including a first main surface and a second main surface; a first electronic component mounted on the first main surface; a second electronic component mounted on the second main surface; an electrode for input/output on the first main surface; a columnar electrode connected to the electrode for input/output; a sealing resin layer covering the first main surface; an insulating layer covering the first electronic component and the sealing resin layer; an input/output electrode on the insulating layer; and a conductor, wherein the columnar electrode 154 includes an end surface exposed from the sealing resin layer, and the input/output electrode is connected to the columnar electrode through the conductor.