公开(公告)号：US20230118261A1

公开(公告)日：2023-04-20

申请号：US18082619

申请日：2022-12-16

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takayuki SHIMAMURA ,  Yusuke KAMITSUBO ,  Ryutatsu MIZUKAMI ,  Sunao FUKUTAKE

IPC: H05K3/46 ,  H05K1/02 ,  H05K3/40

Abstract: A multilayer substrate includes a resin multilayer body including, in a lamination direction, first and second laminate portions respectively including first and second thermoplastic resin layers, and a first interlayer connection conductor extending through the first thermoplastic resin layer. A storage elastic modulus of the first thermoplastic resin layer is lower than that of the second thermoplastic resin layer at a measurement temperature equal to or higher than a minimum melting point among melting points of metallic elements included in the first interlayer connection conductors and equal to or lower than melting points of the first thermoplastic resin layer and the second thermoplastic resin layer.

公开(公告)号：US20210267051A1

公开(公告)日：2021-08-26

申请号：US17319396

申请日：2021-05-13

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yusuke KAMITSUBO ,  Ryosuke TAKADA ,  Tsuyoshi KATSUBE ,  Yasuhiro KURATANI ,  Shigeru TAGO ,  Tomohiro FURUMURA

IPC: H05K1/03 ,  H05K1/14 ,  H05K1/11 ,  H05K3/42 ,  H05K3/00 ,  H05K3/46

Abstract: A resin multilayer substrate includes a multilayer body including resin layers and adhesive layers that are laminated, via conductors in the resin layers, and bonding portions in the adhesive layers. The bonding portion is connected to the via conductor. One of the resin layer and the adhesive layer is a gas high-permeable layer having a higher gas permeability than the other one. The bonding portion includes an organic substance, or has a higher void content rate per unit plane sectional area than the via conductor. At least a portion of each of the bonding portions contacts the gas high-permeable layers.

公开(公告)号：US20210212203A1

公开(公告)日：2021-07-08

申请号：US17206303

申请日：2021-03-19

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yusuke KAMITSUBO ,  Tsuyoshi KATSUBE ,  Ryosuke TAKADA

IPC: H05K1/03 ,  H05K3/46

Abstract: A stacked body includes a first resin layer including a thermoplastic first resin as a main material, a pattern including a conductor layer on one principal surface of the first resin layer, and a second resin layer including a thermoplastic second resin as a main material. The first resin layer is softer than the second resin layer. The first resin layer has a lower dielectric constant than the second resin layer. A pattern including the conductor layer is at least partially embedded in the first resin layer, and includes a portion in contact with the first resin layer along a layer direction (X-Y plane) of the first resin layer and a portion in contact with the first resin layer along a stacking direction (X-Z plane) of the first resin layer, the second resin layer, and the pattern including the conductor layer.

公开(公告)号：US20200178391A1

公开(公告)日：2020-06-04

申请号：US16788426

申请日：2020-02-12

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Atsushi KASUYA ,  Yusuke KAMITSUBO

IPC: H05K1/11 ,  H05K1/02 ,  H05K1/05

Abstract: A resin multilayer board includes a substrate including a stack of resin layers, and a first metal pin including a first end portion exposed at a first main surface of the substrate and penetrating through at least one of the resin layers in a thickness direction, wherein a gap is provided at a portion of an interface between a lateral side of the first metal pin and the resin layer.

公开(公告)号：US20220377886A1

公开(公告)日：2022-11-24

申请号：US17881702

申请日：2022-08-05

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yusuke KAMITSUBO ,  Tsuyoshi KATSUBE ,  Ryosuke TAKADA

IPC: H05K1/03 ,  H05K3/46 ,  H05K3/00 ,  H05K1/02

Abstract: A stacked body includes a first resin layer including a thermoplastic first resin as a main material, a pattern including a conductor layer on one principal surface of the first resin layer, and a second resin layer including a thermoplastic second resin as a main material. The first resin layer is softer than the second resin layer. The first resin layer has a lower dielectric constant than the second resin layer. A pattern including the conductor layer is at least partially embedded in the first resin layer, and includes a portion in contact with the first resin layer along a layer direction (X-Y plane) of the first resin layer and a portion in contact with the first resin layer along a stacking direction (X-Z plane) of the first resin layer, the second resin layer, and the pattern including the conductor layer.

公开(公告)号：US20220141965A1

公开(公告)日：2022-05-05

申请号：US17575706

申请日：2022-01-14

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yusuke KAMITSUBO

IPC: H05K3/46 ,  H05K1/02 ,  H05K1/16 ,  H01F27/28 ,  H01F41/04 ,  H01F41/12 ,  H01F27/32

Abstract: A multilayer substrate includes insulating base materials stacked in a stacking direction, at least one conductor pattern on at least one of the insulating base materials, the at least one conductor pattern including two opposite major surfaces, and insulating protective films on both of the two opposite major surfaces of the at least one conductor pattern.

公开(公告)号：US20210283890A1

公开(公告)日：2021-09-16

申请号：US17331744

申请日：2021-05-27

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yusuke KAMITSUBO ,  Tsuyoshi KATSUBE ,  Ryosuke TAKADA

IPC: B32B27/08 ,  B32B27/30 ,  H05K3/40 ,  H05K3/42 ,  H05K3/32 ,  B32B37/10 ,  B32B3/26 ,  B32B27/18 ,  B32B15/08

Abstract: A resin multilayer substrate includes a laminate including resin layers including a first resin layer and a second resin layer that are laminated, a via conductor in the first resin layer, and a joint portion that includes at least a portion in the second resin layer and is joined to the via conductor. The joint portion is more brittle than the via conductor. A linear expansion coefficient of the second resin layer is larger than a linear expansion coefficient of the via conductor and a linear expansion coefficient of the joint portion, and is smaller than a linear expansion coefficient of the first resin layer.

公开(公告)号：US20220151065A1

公开(公告)日：2022-05-12

申请号：US17584499

申请日：2022-01-26

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yusuke KAMITSUBO

IPC: H05K1/03 ,  B29C43/30 ,  H05K1/02 ,  H05K3/00 ,  B29C43/28

Abstract: A resin multilayer substrate includes a stacked body provided by stacking and thermocompression bonding resin layers, a first conductor pattern inside the stacked body, and a first protective coating covering at least a first surface and a side surface of the first conductor pattern. The resin layers are made of a first thermoplastic resin, and the first protective coating is made of a second thermoplastic resin. Both of the first and second thermoplastic resins soften at a predetermined press temperature or less. The second thermoplastic resin has a storage modulus lower than a storage modulus of the first thermoplastic resin at a temperature equal to or less than the predetermined press temperature and equal to or more than room temperature.

公开(公告)号：US20220141966A1

公开(公告)日：2022-05-05

申请号：US17575717

申请日：2022-01-14

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yusuke KAMITSUBO ,  Tomohiro FURUMURA

IPC: H05K3/46 ,  H05K1/02 ,  H05K1/03

Abstract: A method for manufacturing a multilayer substrate including first and second insulating resin base material layers including different materials, includes configuring a conductor film-attached insulating resin base material with a conductor film on the first insulating resin base material layer, or a second conductor film-attached insulating resin base material with a conductor film on a main surface of the first insulating resin base material layer including a main surface of a stacked body including at least the first insulating resin base material layer, and stacking the first or second conductor film-attached insulating resin base material and another base material layer such that the conductor film is in contact with the second insulating resin base material layer. An adhesion strength of the first insulating resin base material layer to the conductor film is higher than an adhesion strength of the second insulating resin base material layer to the conductor film.

公开(公告)号：US20210014962A1

公开(公告)日：2021-01-14

申请号：US17037869

申请日：2020-09-30

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yusuke KAMITSUBO

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K1/14 ,  H05K3/00 ,  H05K3/40 ,  H05K3/42 ,  H05K3/10

Abstract: A resin substrate includes a resin body, an interlayer connection conductor provided in the resin body, and a conductor pattern bonded to the interlayer connection conductor. The resin body includes a gap provided adjacent to or in a vicinity of a bonding portion of the interlayer connection conductor and the conductor pattern, and a contact portion that contacts the interlayer connection conductor.