公开(公告)号：US06200405B1

公开(公告)日：2001-03-13

申请号：US09229754

申请日：1999-01-14

申请人： Mutsuo Nakazawa ,  Hiroshi Takahashi

发明人： Mutsuo Nakazawa ,  Hiroshi Takahashi

IPC分类号： B23B3112

CPC分类号： H01L21/4857 ,  H01F41/043 ,  H01L21/486 ,  H05K3/0029 ,  Y10T156/1056 ,  Y10T156/1064

摘要： A method useful for the manufacture of multilayer ceramic electronic components such as a multilayer chip inductor, a multilayer transformer, a multilayer hybrid components containing a coil conductor, and the like comprises a process A for preparing a ceramic green sheet, a process B for forming a through hole to the ceramic green sheet, a process C for forming a conductor pattern on the ceramic green sheet, and a process D for stacking said ceramic green sheet to another ceramic green sheet, wherein said process B is executed by irradiating a laser beam onto the ceramic green sheets so as to form through holes to the fragile ceramic green sheet with a pinpoint accuracy.

公开(公告)号：US06399008B1

公开(公告)日：2002-06-04

申请号：US09447352

申请日：1999-11-22

申请人： Mutsuo Nakazawa ,  Satoshi Takakuwa ,  Hiroshi Takahashi ,  Akira Yamanaka ,  Mitsuo Ueno ,  Katsuhiro Oyama

发明人： Mutsuo Nakazawa ,  Satoshi Takakuwa ,  Hiroshi Takahashi ,  Akira Yamanaka ,  Mitsuo Ueno ,  Katsuhiro Oyama

IPC分类号： B29C3508

CPC分类号： B23K26/0823 ,  B23K2101/40 ,  H05K3/0029

摘要： Processing along one circular path is performed by irradiating a laser beam to a ceramic green sheet attached on an outer peripheral surface of a rotating drum, and the processing path is changed by moving at least one of the rotating drum and a beam irradiated position through a predetermined distance in the direction of drum centerline each time the processing on one circular path is completed. If the laser beam is intermittently irradiated to the ceramic green sheet, a matrix of through holes or concave portions can be easily formed in the ceramic green sheet.

摘要翻译： 沿着一个圆形路径的处理是通过将激光束照射到附接在旋转滚筒的外周表面上的陶瓷生片来进行的，并且通过使旋转滚筒和束照射位置中的至少一个移动通过旋转滚筒 每次在一个圆形路径上的处理完成时，在鼓中心线的方向上的预定距离。 如果激光束间歇地照射到陶瓷生片上，则可以容易地在陶瓷生片中形成通孔或凹部的基体。

公开(公告)号：US5948200A

公开(公告)日：1999-09-07

申请号：US686751

申请日：1996-07-26

申请人： Mutsuo Nakazawa ,  Hiroshi Takahashi

发明人： Mutsuo Nakazawa ,  Hiroshi Takahashi

IPC分类号： H01F41/04 ,  H01L21/48 ,  H05K3/00 ,  B32B31/12

CPC分类号： H01L21/4857 ,  H01F41/043 ,  H01L21/486 ,  H05K3/0029 ,  Y10T156/1056 ,  Y10T156/1064

摘要： A method useful for the manufacture of multilayer ceramic electronic components such as a multilayer chip inductor, a multilayer transformer, a multilayer hybrid components containing a coil conductor, and the like comprises a process A for preparing a ceramic green sheet, a process B for forming a through hole to the ceramic green sheet, a process C for forming a conductor pattern on the ceramic green sheet, and a process D for stacking said ceramic green sheet to another ceramic green sheet, wherein said process B is executed by irradiating a laser beam onto the ceramic green sheets so as to form through holes to the fragile ceramic green sheet with a pinpoint accuracy.

摘要翻译： 用于制造多层陶瓷电子部件的方法，例如多层片式电感器，多层变压器，含有线圈导体的多层混合部件等包括制备陶瓷生片的方法A，用于形成的方法B 陶瓷生片的通孔，在陶瓷生片上形成导体图案的工艺C，以及将陶瓷生片堆叠在另一陶瓷生片上的工序D，其中，通过照射激光束 到陶瓷生片上，以便精确地形成通向脆性陶瓷生片的通孔。

公开(公告)号：US06252481B1

公开(公告)日：2001-06-26

申请号：US09451226

申请日：1999-11-29

申请人： Hidemi Iwao ,  Mayumi Arai ,  Kenichi Hoshi ,  Mutsuo Nakazawa

发明人： Hidemi Iwao ,  Mayumi Arai ,  Kenichi Hoshi ,  Mutsuo Nakazawa

IPC分类号： H01F500

CPC分类号： H01G4/232 ,  H01F17/0013 ,  H01F27/292 ,  H01F41/005 ,  H01F41/043

摘要： Delamination in the conventional chip-type electronic part may create voids thereinside, allowing an internal electrode therein to vibrate in presence of external impacts or large electromagnetic forces caused by a high frequency current flowing inside the electrode, in such a way that fatigue may accumulate in the internal electrode, which eventually will results in the internal electrode being electrically disconnected. To solve this problem, a chip-type electronic part of the present invention includes synthetic resins impregnated into the voids to secure the internal electrode, wherein external electrodes of the chip-type electronic part are made of a conductive synthetic resin or a porous conductive material formed by sintering a conductive paste. The former is achieved by impregnating the synthetic resins before the formation of the external electrodes and the later, by extending the pores from surfaces of the external electrodes to surfaces of a main body and then by impregnating the synthetic resins thereinto.

摘要翻译： 常规芯片型电子部件中的分层可能在其内部产生空隙，从而允许内部内部电极在存在外部冲击或由在电极内部流动的高频电流引起的大电磁力的情况下振动，使得疲劳可能累积在 内部电极最终将导致内部电极电断开。 为了解决这个问题，本发明的片式电子部件包括浸渍在空隙中以固定内部电极的合成树脂，其中芯片型电子部件的外部电极由导电合成树脂或多孔导电材料制成 通过烧结导电膏形成。 前者是通过在形成外部电极之前浸渍合成树脂，然后通过将孔从外部电极的表面延伸到主体的表面，然后通过将合成树脂浸渍在其中而实现的。