SENSOR MODULE AND METHOD FOR MANUFACTURING SENSOR MODULE

    公开(公告)号:US20240288326A1

    公开(公告)日:2024-08-29

    申请号:US18574386

    申请日:2022-06-24

    IPC分类号: G01L9/04

    CPC分类号: G01L9/04

    摘要: A sensor module includes: a diaphragm including a first region and a second region that includes a position at which a strain ε that occurs by an effect of a physical quantity caused by a measurement target fluid is zero and has a smaller effect of the physical quantity caused by the measurement target fluid than the first region; strain detecting elements disposed in the first region; and an electric conductor that is at least partially disposed in the second region and electrically couples the strain detecting elements to each other to configure a bridge circuit. The electric conductor includes a resistance adjuster, at a position corresponding to the second region, that adjusts a resistance of the electric conductor.

    STRAIN DETECTOR AND MANUFACTURING METHOD THEREOF

    公开(公告)号:US20170356814A1

    公开(公告)日:2017-12-14

    申请号:US15614708

    申请日:2017-06-06

    IPC分类号: G01L1/22

    CPC分类号: G01L1/2287 G01L9/0051

    摘要: A strain detector includes a strain-causing portion, an insulation film formed on the strain-causing portion, a strain gauge formed on the insulation film and configured to detect the strain generated by the strain-causing portion as electric signals, an electrode connected to the strain gauge, a bonding pad extending from the electrode, a bonding wire connected to the bonding pad, and an insulative resin layer covering the strain gauge without covering the bonding pad and the bonding wire.

    Strain detector and manufacturing method thereof

    公开(公告)号:US10067010B2

    公开(公告)日:2018-09-04

    申请号:US15614708

    申请日:2017-06-06

    IPC分类号: G01L1/22

    CPC分类号: G01L1/2287 G01L9/0051

    摘要: A strain detector includes a strain-causing portion, an insulation film formed on the strain-causing portion, a strain gauge formed on the insulation film and configured to detect the strain generated by the strain-causing portion as electric signals, an electrode connected to the strain gauge, a bonding pad extending from the electrode, a bonding wire connected to the bonding pad, and an insulative resin layer covering the strain gauge without covering the bonding pad and the bonding wire.