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公开(公告)号:US11261085B2
公开(公告)日:2022-03-01
申请号:US16084214
申请日:2018-05-02
IPC分类号: B81C99/00 , B29C41/02 , B82B3/00 , B81C1/00 , H01L31/0224 , G02B5/18 , B82Y40/00 , B42D25/36 , B42D25/40
摘要: A method to remove selected parts of a thin-film material otherwise uniformly deposited over a template is disclosed. The methods rely on a suitable potting material to encapsulate and snatch the deposited material on apexes of the template. The process may yield one and/or two devices during a single process step: (i) thin-film material(s) with micro- and/or nano-perforations defined by the shape of template apexes, and (ii) micro- and/or nano-particles shaped and positioned in the potting material by the design of the template apexes. The devices made from this method may find applications in fabrication of mechanical, chemical, electrical and optical devices.