公开(公告)号：US20220341053A1

公开(公告)日：2022-10-27

申请号：US17718756

申请日：2022-04-12

Applicant: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY

Inventor： Shiro HARA ,  Fumito IMURA ,  Sommawan KHUMPUANG ,  Yuuki ISHIDA ,  Toshihiro KIKUNO ,  Takafumi YOSHINAGA ,  Kayo KAMASAKI ,  Mitsuhiko FUKUYAMA ,  Tetuya MORIZONO

IPC: C25D17/08 ,  C25D17/00

Abstract: The plating machine 1 comprises a plurality of treatment units 14 and a conveying means 13 that conveys a wafer W to the plurality of treatment units 14, wherein the conveying means 13 includes an arm 31 that is provided, on one end side, with a plating tool 32 that holds the wafer W, and an arm rotation drive unit 33 that rotates the arm 31 around another end side of the arm 31, and the plurality of treatment units 14 is arranged at predetermined intervals on a rotation trajectory of the plating tool 32.