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公开(公告)号:US20220341053A1
公开(公告)日:2022-10-27
申请号:US17718756
申请日:2022-04-12
Inventor: Shiro HARA , Fumito IMURA , Sommawan KHUMPUANG , Yuuki ISHIDA , Toshihiro KIKUNO , Takafumi YOSHINAGA , Kayo KAMASAKI , Mitsuhiko FUKUYAMA , Tetuya MORIZONO
Abstract: The plating machine 1 comprises a plurality of treatment units 14 and a conveying means 13 that conveys a wafer W to the plurality of treatment units 14, wherein the conveying means 13 includes an arm 31 that is provided, on one end side, with a plating tool 32 that holds the wafer W, and an arm rotation drive unit 33 that rotates the arm 31 around another end side of the arm 31, and the plurality of treatment units 14 is arranged at predetermined intervals on a rotation trajectory of the plating tool 32.
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公开(公告)号:US20210302034A1
公开(公告)日:2021-09-30
申请号:US17210361
申请日:2021-03-23
Inventor: Shiro HARA , Hitoshi MAEKAWA , Sommawan KHUMPUANG , Takashi YAJIMA , Yuuki ISHIDA
Abstract: An encapsulated cleanroom system comprising a processing chamber and a storage section in which the processing chamber is stored, wherein, during operation, the pressure in the storage section is lower or higher than the pressures in the processing chamber and exterior space. The system can simultaneously prevent the entry of outside gases into its processing chamber and the leakage of the gases inside the processing chamber to the exterior space.
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