公开(公告)号：US20170313044A1

公开(公告)日：2017-11-02

申请号：US14968562

申请日：2015-12-14

Applicant: NDSU RESEARCH FOUNDATION

Inventor： Val R. Marinov ,  Orven Swenson ,  Mark Pavicic ,  Ross A. Miller ,  Zhigang Chen ,  Ferdous Sarwar ,  Matthew R. Semler

IPC: B32B37/00 ,  H01L23/00 ,  H01L21/67 ,  H01L21/683

CPC classification number: B29C65/1606 ,  B29C65/16 ,  B29C65/1635 ,  B32B37/025 ,  H01L21/67132 ,  H01L21/68 ,  H01L21/6835 ,  H01L24/83 ,  H01L2221/68318 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2224/83001 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2924/01029 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/3512 ,  H01L2924/00

Abstract: Electronic components are often assembled using robotic equipment, such as pick-and-place machines, that is not optimized for components such as ultra-thin semiconductor bare dice. Selective laser-assisted die transfer is described based on the unique blistering behavior of a multilayer dynamic release layer when irradiated by low energy focused laser pulse(s) in which the blister creates translation of the article being placed. Accurate placement results are provided with negligible lateral and angular displacement.

公开(公告)号：US09862141B2

公开(公告)日：2018-01-09

申请号：US14968562

申请日：2015-12-14

Applicant: NDSU RESEARCH FOUNDATION

Inventor： Val R. Marinov ,  Orven Swenson ,  Mark Pavicic ,  Ross A. Miller ,  Zhigang Chen ,  Ferdous Sarwar ,  Matthew R. Semler

IPC: B32B37/14 ,  B29C65/16 ,  H01L21/683 ,  B32B38/10 ,  B32B37/00 ,  H01L21/68

CPC classification number: B29C65/1606 ,  B29C65/16 ,  B29C65/1635 ,  B32B37/025 ,  H01L21/67132 ,  H01L21/68 ,  H01L21/6835 ,  H01L24/83 ,  H01L2221/68318 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2224/83001 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2924/01029 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/3512 ,  H01L2924/00

Abstract: Electronic components are often assembled using robotic equipment, such as pick-and-place machines, that is not optimized for components such as ultra-thin semiconductor bare dice. Selective laser-assisted die transfer is described based on the unique blistering behavior of a multilayer dynamic release layer when irradiated by low energy focused laser pulse(s) in which the blister creates translation of the article being placed. Accurate placement results are provided with negligible lateral and angular displacement.

公开(公告)号：US20140238592A1

公开(公告)日：2014-08-28

申请号：US14046809

申请日：2013-10-04

Applicant: NDSU RESEARCH FOUNDATION

Inventor： Val R. Marinov ,  Orven Swenson ,  Mark Pavicic ,  Ross A. Miller ,  Zhigang Chen ,  Ferdous Sarwar ,  Matthew R. Semler

IPC: B32B37/00

CPC classification number: B29C65/1606 ,  B29C65/16 ,  B29C65/1635 ,  B32B37/025 ,  H01L21/67132 ,  H01L21/68 ,  H01L21/6835 ,  H01L24/83 ,  H01L2221/68318 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2224/83001 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2924/01029 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/3512 ,  H01L2924/00

Abstract: Electronic components are often assembled using robotic equipment, such as pick-and-place machines, that is not optimized for components such as ultra-thin semiconductor bare dice. Selective laser-assisted die transfer is described based on the unique blistering behavior of a multilayer dynamic release layer when irradiated by low energy focused laser pulse(s) in which the blister creates translation of the article being placed. Accurate placement results are provided with negligible lateral and angular displacement.

Abstract translation: 电子部件通常使用诸如拾放机器的机器人设备进行组装，这些机器设备未针对诸如超薄半导体裸骰子的部件进行优化。 基于由低能量聚焦激光脉冲照射的多层动态释放层的独特起泡行为描述了选择性激光辅助芯片转印，其中水泡产生被放置物品的翻译。 提供准确的放置结果具有可忽略的横向和角位移。