公开(公告)号：US20200060046A1

公开(公告)日：2020-02-20

申请号：US16662479

申请日：2019-10-24

申请人： NEC Network and Sensor Systems, Ltd.

发明人： Masahiro MURAKAMI ,  Norio MASUDA

IPC分类号： H05K7/20 ,  H05K5/02

摘要： To provide an electronic component housing apparatus that is able to efficiently cool the heat of a first and second electronic component, a first electronic component housing chamber 5000 houses the high voltage power supply module 100 (the first electronic component). A second electronic component housing chamber 6000 houses the TWT 200 (the second electronic component). At least some of a first partition plate 2500 and a second partition plate 2600 are provided so as to face each other. A first gap part G1 is provided between the first partition plate 2500 and the second partition plate 2600.

公开(公告)号：US20180324981A1

公开(公告)日：2018-11-08

申请号：US15772914

申请日：2016-12-01

申请人： NEC Network and Sensor Systems, Ltd.

发明人： Masahiro MURAKAMI ,  Norio MASUDA

IPC分类号： H05K7/20 ,  H05K5/02

CPC分类号： H05K7/20445 ,  H05K5/0217 ,  H05K5/023 ,  H05K5/04 ,  H05K7/20 ,  H05K7/20145 ,  H05K7/20172 ,  H05K7/209 ,  H05K7/20909

摘要： To provide an electronic component housing apparatus that is able to efficiently cool the heat of a first and second electronic component, a first electronic component housing chamber 5000 houses the high voltage power supply module 100 (the first electronic component). A second electronic component housing chamber 6000 houses the TWT 200 (the second electronic component). At least some of a first partition plate 2500 and a second partition plate 2600 are provided so as to face each other. A first gap part G1 is provided between the first partition plate 2500 and the second partition plate 2600.