公开(公告)号：US20230402306A1

公开(公告)日：2023-12-14

申请号：US18298404

申请日：2023-04-11

Applicant: NGK INSULATORS, LTD.

Inventor： Reo WATANABE ,  Daisuke TSUNEKAWA ,  Kanto WATANABE

IPC: H01L21/677 ,  H01L21/683

CPC classification number: H01L21/67778 ,  H01L21/683

Abstract: A wafer placement table includes: a ceramic substrate having a wafer placement surface and incorporating an electrode; a conductive embedded member electrically connected to the electrode; a conductive terminal with a female thread, the conductive terminal being electrically connected to the conductive embedded member, having a projection projecting from a surface, on an opposite side to the wafer placement surface, of the ceramic substrate, having the female thread at an end face of the projection; a conductive adapter that is mounted on the end face of the projection of the conductive terminal with the female thread, has a communication hole that communicates with the female thread, and is non-rotatable relative to the conductive terminal with the female thread; and a conductive connection member with a male thread, the conductive connection member having the male thread screwed into the female thread through the communication hole, and being integrated with the adapter.