公开(公告)号：US20160208397A1

公开(公告)日：2016-07-21

申请号：US14993423

申请日：2016-01-12

Applicant: NGK INSULATORS, LTD.

Inventor： Masashi OHNO ,  Satoshi ISHIBASHI ,  Shoji YOKOI ,  Naoya TAKASE

IPC: C25B11/02

CPC classification number: C25B11/02 ,  H05H1/2406 ,  H05H2001/2418 ,  H05H2001/2431

Abstract: The electrode includes an insulator having a hollow portion (first hollow portion and second hollow portion) and a conductor provided in the hollow portion of the insulator. An edge portion of one end surface of at least the conductor is covered with the insulator.

Abstract translation: 电极包括具有中空部分（第一中空部分和第二中空部分）和设置在绝缘体的中空部分中的导体的绝缘体。 至少导体的一个端面的边缘部分被绝缘体覆盖。

公开(公告)号：US20140065375A1

公开(公告)日：2014-03-06

申请号：US14014956

申请日：2013-08-30

Applicant: NGK Insulators, Ltd.

Inventor： Kunihiko YOSHIOKA ,  Satoshi ISHIBASHI

IPC: H05K13/00 ,  B32B18/00 ,  B32B7/02 ,  H05K1/03

CPC classification number: H05K13/00 ,  B32B7/02 ,  B32B18/00 ,  C04B35/634 ,  C04B37/008 ,  C04B2235/604 ,  C04B2235/608 ,  C04B2237/348 ,  C04B2237/62 ,  C04B2237/66 ,  C04B2237/704 ,  C04B2237/708 ,  H01M8/0215 ,  H01M2008/1293 ,  H05K1/0306 ,  Y02E60/525 ,  Y02P70/56 ,  Y10T428/24744

Abstract: Provided is a method of producing “a ceramic green bonded compact in which a ceramic green film is bonded on each bonding surface of a ceramic green substrate having hole portions,” the method imparting good adhesiveness to a thin green film while suppressing the green substrate from having deformation. In this method, first, a layer of a paste for bonding is formed on each bonding surface of green sheets prepared. Next, each bonding surface of the green sheets on which the paste layer is formed is brought into contact, in a state in which the paste layer is wet, with each bonding surface of a porous ceramic green substrate prepared. While this state is maintained, pores in the green substrate absorb a dispersion medium in the paste layer in the wet state. As a result, the paste layer is dried, thereby completely bonding the green substrate and the green sheets.

Abstract translation: 本发明提供一种制造“陶瓷绿色接合体的陶瓷绿色接合体的方法”，其中陶瓷生坯被粘结在具有孔部分的陶瓷生坯基材的接合表面上，该方法赋予了对绿色薄膜的良好粘附性， 有变形。 在该方法中，首先，在制备的生片的每个接合面上形成用于接合的糊料层。 接下来，在形成有糊层的生片的每个接合表面在糊层湿润的状态下与多孔陶瓷生坯基板的各接合表面进行接触。 当保持这种状态时，绿色底物中的孔在湿润状态下吸收膏层中的分散介质。 结果，干燥糊料层，从而完全粘接生坯基材和生片。