公开(公告)号：US11887873B2

公开(公告)日：2024-01-30

申请号：US16822541

申请日：2020-03-18

申请人： NGK INSULATORS, LTD.

发明人： Keita Mine ,  Takumi Wakisaka

IPC分类号： H01L21/67 ,  H01L21/673 ,  H01L21/683 ,  H01B3/28 ,  H05B3/28

CPC分类号： H01L21/67109 ,  H01L21/673 ,  H01L21/6833 ,  H01L21/6835 ,  H05B3/283 ,  H05B2203/016 ,  H05B2203/017

摘要： A wafer placement apparatus includes a ceramic plate having an upper surface as a wafer placement surface and in which an electrode is embedded; and a cooling plate provided on a lower surface, opposite a wafer placement surface, of a ceramic plate and in which a refrigerant passage is provided, wherein a refrigerant passage includes a first passage forming a single continuous line and extending parallel to a wafer placement surface, and a second passage forming a single continuous line and extending along a first passage, an outlet of a second passage being positioned near an inlet of a first passage, an inlet of a second passage being positioned near an outlet of a first passage.

公开(公告)号：US12087609B2

公开(公告)日：2024-09-10

申请号：US17804617

申请日：2022-05-31

申请人： NGK Insulators, Ltd.

发明人： Tatsuya Kuno ,  Takumi Wakisaka

IPC分类号： H01L21/683 ,  H01L21/67 ,  H01L21/687

CPC分类号： H01L21/6833 ,  H01L21/67248 ,  H01L21/68757 ,  H01L21/68785 ,  H01L21/6831

摘要： A wafer placement table includes a ceramic substrate that has a wafer placement surface, a first electrode that is embedded in the ceramic substrate, a first power supply terminal that is inserted from a surface of the ceramic substrate opposite the wafer placement surface toward the first electrode, a first joint that joins the first electrode and the first power supply terminal to each other and a second electrode that is disposed between the wafer placement surface and the first electrode in the ceramic substrate. A linear portion that extends in the ceramic substrate from a position on the first electrode opposite the first joint to the wafer placement surface is composed of material of the ceramic substrate.