公开(公告)号：US20210057152A1

公开(公告)日：2021-02-25

申请号：US16963301

申请日：2019-03-28

Applicant: NGK SPARK PLUG CO., LTD.

Inventor： Takayuki MIYAJI

IPC: H01G2/10 ,  H01G2/06

Abstract: Package 1a has ceramic substrate body 2 having front and back surfaces 3, 4 and side surface 5 between these surfaces, cavity 6 opening on front surface 3 and having bottom surface 7 and inner side surface 8, electrode pad 9 formed on bottom surface 7, external connecting terminal 10 formed on back surface 4, electronic component 14 mounted on electrode pad 9 and electrolyte 16 filling cavity 6. Electrode pad 9 and external connecting terminal 10 are electrically connected to each other through via conductor 12 penetrating ceramic layer c1 forming bottom surface 7 of cavity 6 and back surface 4 of substrate body 2. Side surface conductor 17 is provided on side surface 5 of substrate body 2, and side surface conductor 17 and external connecting terminal 10 are connected to each other. Electrode pad 9 and side surface conductor 17 are separate from each other.

公开(公告)号：US20200235019A1

公开(公告)日：2020-07-23

申请号：US16717092

申请日：2019-12-17

Applicant: NGK SPARK PLUG CO., LTD.

Inventor： Takayuki MIYAJI

IPC: H01L23/053 ,  H05K1/11 ,  H01L23/00 ,  H02H9/00

Abstract: A package has a package body formed by stacked insulating layers and having a front surface including a mounting area, a back surface and a side surface; a plurality of hollow portions arranged so as to be adjacent to each other on the front surface of the package body; a plurality of electrode pads individually placed on respective bottom surfaces of the hollow portions; and a partition wall formed by at least one insulating layer that forms the package body and having protruding banks at its both edge sides. Surfaces of the electrode pads are located at a lower position with respect to the front surface of the package body. The hollow portions are arranged at opposite sides of the partition wall. The electrode pads are electrically connected to respective conductor layers that are formed on the back surface and/or the side surface of the package body.

公开(公告)号：US20200227207A1

公开(公告)日：2020-07-16

申请号：US16659902

申请日：2019-10-22

Applicant: NGK SPARK PLUG CO., LTD.

Inventor： Takayuki MIYAJI

IPC: H01G2/10 ,  H05K5/06 ,  H05K5/00 ,  H05K5/02 ,  H01L23/18 ,  H01G4/224

Abstract: Disclosed is a ceramic package for filling with a liquid-containing electrolyte, which includes: a package body defining a recessed cavity open at a front surface of the package body and including first and second ceramic layers stacked together; a plurality of electrode pads disposed on a bottom surface of the recessed cavity; and a plurality of outer connection terminals disposed on a back surface of the package body, wherein each of the electrode pads includes a pad body portion having a polygonal shape in plan view and an interlayer pad portion formed along an interlayer surface between the first and second ceramic layers, wherein the interlayer pad portion has a protruding part protruding outwardly from the pad body portion, and wherein via conductors are formed between the protruding parts of the electrode pads and the outer connection terminals through the first ceramic layer.