公开(公告)号：US20190214042A1

公开(公告)日：2019-07-11

申请号：US16357181

申请日：2019-03-18

申请人： Magnecomp Corporation

发明人： Kuen Chee Ee ,  Long Zhang ,  Peter Hahn ,  David Glaess

IPC分类号： G11B5/48 ,  G11B5/55 ,  G11B5/56

CPC分类号： G11B5/483 ,  G11B5/4873 ,  G11B5/5552 ,  G11B5/56

摘要： A multi-layer piezoelectric microactuator assembly has at least one poled and active piezoelectric layer and one poled but inactive piezoelectric layer. The poled but inactive layer acts as a constraining layer in resisting expansion or contract of the first piezoelectric layer thereby reducing or eliminating bending of the assembly as installed in an environment, thereby increasing the effective stroke length of the assembly. Poling only a single layer would induce stresses into the device; hence, polling both piezoelectric layers even though only one layer will be active in use reduces stresses in the device and therefore increases reliability.

公开(公告)号：US10068598B2

公开(公告)日：2018-09-04

申请号：US15915520

申请日：2018-03-08

申请人： SEAGATE TECHNOLOGY LLC

发明人： Reed D. Hanson ,  Kenneth A. Haapala ,  Dwight R. Kinney ,  Xinghui Huang

IPC分类号： G11B5/55 ,  G11B5/48 ,  G11B5/596

CPC分类号： G11B5/556 ,  G11B5/4873 ,  G11B5/59622

摘要： Systems and methods for compensating for hysteresis in a disc drive are described. In one embodiment, a method may use an inverse hysteresis model to linearize effects of hysteresis of a microactuator in the disc drive. The hysteresis model may be a Coleman-Hodgdon hysteresis model. The hysteresis of the microactuator may be characterized, and the inverse hysteresis model may be based at least in part on the characterization. The inverse hysteresis model may be used to implement a digital filter. The digital filter may be employed in series with the microactuator to linearize the effects of hysteresis.

公开(公告)号：US20180159019A1

公开(公告)日：2018-06-07

申请号：US15830646

申请日：2017-12-04

申请人： TDK CORPORATION

发明人： Masaru NANAO ,  Kouhei OHHASHI ,  Kenta ISHII

IPC分类号： H01L41/08 ,  H01L41/047 ,  H01L41/113 ,  B41J2/14

CPC分类号： H01L41/0815 ,  B41J2/14201 ,  B41J2/14233 ,  B41J2202/03 ,  G11B5/483 ,  G11B5/4873 ,  H01L41/0477 ,  H01L41/0973 ,  H01L41/1132 ,  H01L41/1873 ,  H01L41/22

摘要： A piezoelectric thin film-stacked body is provided. A piezoelectric thin film-stacked body has a first electrode layer, a first intermediate layer stacked on the first electrode layer, a second intermediate layer stacked on the first intermediate layer, and a piezoelectric thin film stacked on the second intermediate layer, the first intermediate layer includes K, Na, and Nb, the second intermediate layer is a layer causing stress in a compression direction in the piezoelectric thin film, and the piezoelectric thin film includes (K,Na)NbO3.

公开(公告)号：US09992868B2

公开(公告)日：2018-06-05

申请号：US15305188

申请日：2015-03-20

申请人： NITTO DENKO CORPORATION

发明人： Yuu Sugimoto

IPC分类号： H05K1/03 ,  H05K1/05 ,  G11B5/48 ,  H05K1/11

CPC分类号： H05K1/05 ,  G11B5/484 ,  G11B5/4853 ,  G11B5/4873 ,  H05K1/056 ,  H05K1/113

摘要： A wired circuit board includes a metal pedestal portion formed from a metal material that is the same as the material of the metal supporting board at the pad portion, a pedestal opening formed by opening the metal pedestal portion, a lower conductive layer disposed on one side in the thickness direction of the metal pedestal portion as the first conductive layer, and an upper conductive layer as the second conductive layer formed on one side in the thickness direction of the lower conductive layer as the first conductive layer, wherein one of the lower conductive layer as the first conductive layer and the upper conductive layer as the second conductive layer is disposed in the pedestal opening when projected in the thickness direction, and the periphery of the other is disposed outside of the pedestal opening when projected in the thickness direction.

公开(公告)号：US09905273B2

公开(公告)日：2018-02-27

申请号：US15138280

申请日：2016-04-26

申请人： Seagate Technology LLC

发明人： Antanas Daugela ,  Neal F. Gunderson ,  Reed D. Hanson ,  Ricardo P. Freeman ,  Andrew R. Motzko ,  Erik J. Lindquist

IPC分类号： G11B33/08 ,  G11B33/10

CPC分类号： G11B33/08 ,  G11B5/4813 ,  G11B5/4833 ,  G11B5/4873 ,  G11B5/5582 ,  G11B5/59694 ,  G11B33/10

摘要： An apparatus includes an actuator assembly, a dampening assembly coupled to the actuator assembly, and a vibration sensor assembly coupled to the dampening assembly and coupled to the actuator assembly by way of the dampening assembly. A method includes attaching a dampening assembly to an actuator assembly and attaching a vibration sensor assembly to the dampening assembly. The dampening assembly is positioned between the vibration sensor assembly and the actuator assembly.

公开(公告)号：US09865288B2

公开(公告)日：2018-01-09

申请号：US15040199

申请日：2016-02-10

申请人： NITTO DENKO CORPORATION

发明人： Naohiro Terada ,  Saori Kanezaki ,  Hiroyuki Tanabe ,  Yoshito Fujimura

IPC分类号： G11B15/48 ,  H05K1/05 ,  G11B5/48 ,  H05K3/30

CPC分类号： G11B5/4853 ,  G06F1/184 ,  G11B5/4826 ,  G11B5/4873 ,  H05K1/056 ,  H05K3/305 ,  Y02P70/613

摘要： A suspension board with circuit includes one pair of pedestals. A pedestal conductive layer of one pedestal has a fan portion and a continuous portion. The pedestal conductive layer of the other pedestal has at least the fan portion. When the pedestal conductive layer of the other pedestal has only the fan portion, the pedestal supporting layer is disposed so as to be overlapped with the fan portion in the thickness direction in each of the pedestals and so as not to be overlapped with the continuous portion in the one pedestal and when the pedestal conductive layer of the other pedestal has the continuous portion, the pedestal supporting layer is disposed so as to be overlapped with the continuous portion or is disposed so as to be overlapped with the fan portion and so as not to be overlapped with the continuous portion in each of the pedestals.

公开(公告)号：US09805749B1

公开(公告)日：2017-10-31

申请号：US15094055

申请日：2016-04-08

申请人： Seagate Technology LLC

发明人： Chuen Buan Lee ,  Tim Rausch ,  Xiong Liu ,  Qiang Bi

IPC分类号： G11B11/00 ,  G11B5/48 ,  G11B5/00

CPC分类号： G11B5/4826 ,  G11B5/105 ,  G11B5/4833 ,  G11B5/484 ,  G11B5/4866 ,  G11B5/4873 ,  G11B2005/0021

摘要： An apparatus comprises a heat-assisted magnetic recording drive which includes an enclosure having a base and a cover. The drive includes a magnetic recording disk and a head gimbal assembly proximate one of the base and the cover. The HGA supports a slider assembly comprising a laser diode unit. The LDU projects away from the HGA towards one of the base and the cover. An arcuate channel is provided in one of the base and the cover and dimensioned to receive a distal portion of the LDU. The channel has a length that accommodates the distal portion of the LDU along a stroke of the HGA.

公开(公告)号：US20170298526A1

公开(公告)日：2017-10-19

申请号：US15444000

申请日：2017-02-27

申请人： Magnecomp Corporation

发明人： Marcos Lazatin ,  Brett Holaway

IPC分类号： C25D3/48 ,  C25D5/02 ,  B23K20/10 ,  B23K1/00 ,  C25D7/06 ,  G11B5/48 ,  B23K101/38

CPC分类号： C25D3/48 ,  B23K1/0016 ,  B23K20/10 ,  B23K2101/38 ,  C25D5/022 ,  C25D5/12 ,  C25D5/36 ,  C25D5/50 ,  C25D7/00 ,  C25D7/0607 ,  G11B5/483 ,  G11B5/4873 ,  G11B33/1493

摘要： A stainless steel suspension component such as a mount plate is chemically activated by exposure to an activating solution. Gold is then spot plated onto the mount plate in the activated area using an elastomeric mask that is clamped over the mount plate. A component may then be bonded to the gold bond pads. The component may include a PZT microactuator bonded to the gold bond pads using a conductive adhesive such as silver epoxy. The gold acts as an interface metal that provides to a low resistance and environmentally robust ground path for the microactuator.

公开(公告)号：US09786831B1

公开(公告)日：2017-10-10

申请号：US15402230

申请日：2017-01-09

申请人： Magnecomp Corporation

发明人： Kuen Chee Ee

IPC分类号： G11B5/48 ,  H01L41/09 ,  H01L41/083 ,  H01L41/187 ,  H01L41/047 ,  G11B5/55

CPC分类号： G11B5/5552 ,  G11B5/4833 ,  G11B5/4873 ,  H01L41/047 ,  H01L41/0986 ,  H02N2/02

摘要： A microactuator for a dual stage actuated suspension for a hard disk drive is constructed as a longitudinal stack of piezoelectric (PZT) elements acting in the d33 mode, expanding or contracting longitudinally when an electric field is applied across them in the longitudinal direction. The microactuator has interlaced electrode fingers that separate and define the individual PZT elements, and apply the electric field. A stiff constraint layer having a high Young's modulus is affixed to the microactuator on the side opposite the suspension to which the microactuator is bonded. The constraint layer may be a layer of substantially inactive PZT material that is formed integrally with the PZT elements but without electrodes in the inactive PZT layer. The presence of the stiff constraint layer increases the effective stroke length of the microactuator.

公开(公告)号：US09721598B2

公开(公告)日：2017-08-01

申请号：US14695646

申请日：2015-04-24

申请人： NHK Spring Co., Ltd.

发明人： Sei Kawao ,  Yukie Yamada

IPC分类号： G11B5/48

CPC分类号： G11B5/483 ,  G11B5/48 ,  G11B5/4833 ,  G11B5/4846 ,  G11B5/4853 ,  G11B5/4873

摘要： A terminal pad of a flexure for a head suspension connected to a functional part through a bonding material includes a terminal body, a base plating formed on a surface of the terminal body and having an uniform thickness, a padding plating made of a same material as the base plating and integrated with the base plating so that the padding plating swells with respect to the base plating, and a surface plating formed on a surface of the padding plating.