公开(公告)号：US20250026951A1

公开(公告)日：2025-01-23

申请号：US18885892

申请日：2024-09-16

Applicant: NHK SPRING CO., LTD.

Inventor： Katsumi MIZUNO ,  Kohei SHIMOMURA ,  Saki SUDO

IPC: C09D163/08 ,  C08G59/02 ,  C08G59/24 ,  C08G59/50 ,  C08G59/68 ,  C08K3/38 ,  C09D5/00 ,  C09D7/61 ,  H05K1/05

Abstract: An epoxy resin composition for interlayer insulation, a resin sheet for interlayer insulation, a laminate for a circuit board, a metal-based circuit board, and a power module which realize an excellent adhered-state heat resistance and which allow for the retention of good voltage resistance at a high level are provided. An epoxy resin composition for interlayer insulation according to an embodiment of the present invention contains an epoxy resin, an epoxy-modified polybutadiene compound, and an aromatic amine compound. The epoxy-modified polybutadiene compound contains a repeating unit represented by the general formula (I), a repeating unit represented by the general formula (II), and a repeating unit represented by the general formula (III), and contains at least one of a repeating unit represented by the general formula (i), a repeating unit represented by the general formula (ii), and a repeating unit represented by the general formula (iii):