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公开(公告)号：US20250026951A1
公开(公告)日：2025-01-23
申请号：US18885892
申请日：2024-09-16
Applicant: NHK SPRING CO., LTD.
Inventor： Katsumi MIZUNO , Kohei SHIMOMURA , Saki SUDO
IPC: C09D163/08 , C08G59/02 , C08G59/24 , C08G59/50 , C08G59/68 , C08K3/38 , C09D5/00 , C09D7/61 , H05K1/05
Abstract: An epoxy resin composition for interlayer insulation, a resin sheet for interlayer insulation, a laminate for a circuit board, a metal-based circuit board, and a power module which realize an excellent adhered-state heat resistance and which allow for the retention of good voltage resistance at a high level are provided. An epoxy resin composition for interlayer insulation according to an embodiment of the present invention contains an epoxy resin, an epoxy-modified polybutadiene compound, and an aromatic amine compound. The epoxy-modified polybutadiene compound contains a repeating unit represented by the general formula (I), a repeating unit represented by the general formula (II), and a repeating unit represented by the general formula (III), and contains at least one of a repeating unit represented by the general formula (i), a repeating unit represented by the general formula (ii), and a repeating unit represented by the general formula (iii):
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公开(公告)号：US20190037692A1
公开(公告)日：2019-01-31
申请号：US16147324
申请日：2018-09-28
Applicant: NHK SPRING CO., LTD.
Inventor： Katsumi MIZUNO , Kazuhiko KONOMI , Yutaka NATSUME
IPC: H05K1/05 , H01L23/14 , H01L23/373 , H01L23/498 , H05K1/03
Abstract: A method of manufacturing a circuit board laminate including a metal substrate, an insulating layer disposed on at least one surface of the metal substrate, and a metal foil disposed on the insulating later, the method including: forming, on at least one of the metal substrate and the metal foil, a film that includes a composition containing a bisphenol cyanate resin, a novolac cyanate resin and an inorganic filler; obtaining a laminate by joining the metal substrate and the metal foil to face each other with the film interposed therebetween; and heating the laminate at a temperature higher than 200° C. to form a crosslinked copolymer consisting of the bisphenol cyanate resin and the novolac cyanate resin in the film, and to obtain the insulating layer comprising the crosslinked copolymer.
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公开(公告)号：US20150118509A1
公开(公告)日：2015-04-30
申请号：US14589531
申请日：2015-01-05
Applicant: NHK SPRING CO., LTD.
Inventor： Katsumi MIZUNO , Kazuhiko KONOMI , Yutaka NATSUME
CPC classification number: H05K1/056 , H01L23/142 , H01L23/3735 , H01L23/49894 , H01L2224/32225 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H05K1/0373 , H05K2201/0209 , Y10T428/31678 , H01L2924/00
Abstract: Disclosed is a circuit board laminate including a metal substrate, an insulating layer disposed on at least one surface of the metal substrate and a metal foil disposed on the insulating layer. Characteristically, the insulating layer contains a crosslinked copolymer of bisphenol cyanate resin and novolac cyanate resin and an inorganic filler.
Abstract translation: 公开了一种电路板层叠体，其包括金属基板，设置在金属基板的至少一个表面上的绝缘层和设置在绝缘层上的金属箔。 特征在于，绝缘层含有双酚氰酸酯树脂和酚醛清漆氰酸酯树脂的交联共聚物和无机填料。
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公开(公告)号：US20170332488A1
公开(公告)日：2017-11-16
申请号：US15666540
申请日：2017-08-01
Applicant: NHK SPRING CO., LTD.
Inventor： Katsumi MIZUNO , Daiki IKEDA
CPC classification number: H05K1/056 , H05K1/0256 , H05K1/0263 , H05K1/0373 , H05K3/103 , H05K3/20 , H05K3/202 , H05K3/44 , H05K2201/0137 , H05K2201/09672 , H05K2201/09727 , H05K2201/1028 , H05K2203/0278 , H05K2203/1105
Abstract: According to one embodiment, a metal base circuit board includes a metal base substrate, a first circuit pattern, and a first insulating layer between the metal base substrate and the first circuit pattern. The first insulating layer covers a lower surface of the first circuit pattern and at least part of a side surface of the first circuit pattern, the lower surface facing the metal base substrate, the at least part of the side surface being adjacent to the lower surface.
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