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公开(公告)号：US20250081701A1
公开(公告)日：2025-03-06
申请号：US18813021
申请日：2024-08-23
Applicant: NICHIA CORPORATION
Inventor： Hiroto KUME , Atsushi HOSOKAWA
IPC: H01L33/64
Abstract: A bonded substrate includes a metal plate; a first ceramic; and a first metal body disposed between a first surface of the metal plate and a first surface of the first ceramic and disposed on 80% or more of a lateral surface continuous with the first surface of the first ceramic.
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